Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8049337 | Substrate and manufacturing method of package structure | Ming Sun | 2011-11-01 |
| 7692290 | Heat slug and semiconductor package | Pin Hung Chiu, Chun-Chen Liu | 2010-04-06 |
| 7604469 | Degating device | Chin-Sung Lee, Chia-Ming Chang, Yu-Chang Tsai | 2009-10-20 |
| 7144239 | Molding apparatus with a molding flowability sensor for packaging semiconductor device | Wei Wang, Kuang-Lin Lo | 2006-12-05 |