Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7989937 | Package structure and manufacturing method thereof | — | 2011-08-02 |
| 7642133 | Method of making a semiconductor package and method of making a semiconductor device | Yen-Yi Wu, Wei-Yueh Sung, Pao-Huei Chang Chien, Chi-Chih Chu, Cheng-Yin Lee | 2010-01-05 |
| 7589408 | Stackable semiconductor package | Yung-Li Lu, Cheng-Yin Lee | 2009-09-15 |
| 7550832 | Stackable semiconductor package | Yung-Li Lu | 2009-06-23 |
| 7547962 | Chip package with a ring having a buffer groove that surrounds the active region of a chip | Yung-Li Lu | 2009-06-16 |
| 7442580 | Manufacturing method of a package structure | Cheng-Yin Lee | 2008-10-28 |
| 7439619 | Electronic package structure and the packaging process thereof | Chi-Chih Chu, Shih-Chang Lee | 2008-10-21 |
| 7432127 | Chip package and package process thereof | Yung-Li Lu, Ying-Tsai Yeh | 2008-10-07 |
| 7365427 | Stackable semiconductor package | Yung-Li Lu | 2008-04-29 |
| 7195956 | Method for balancing molding flow during the assembly of semiconductor packages with defective carrying units | Shih-Chang Lee, Wei-Chang Tai | 2007-03-27 |
| 7193282 | Contact sensor package | Che-Ya Chou, Shih-Chang Lee | 2007-03-20 |
| 7187067 | Sensor chip packaging structure | Yung-Li Lu, Ying-Tsai Yeh | 2007-03-06 |
| 7187070 | Stacked package module | Chi-Chih Chu, Cheng-Yin Lee, Shih-Chang Lee | 2007-03-06 |
| 7126221 | Semiconductor package | Yung-Li Lu, Chi-Chih Chu, Shih-Chang Lee | 2006-10-24 |
| 7122893 | Semiconductor package structure | Ching-Hui Chang, Yung-Li Lu, Yu-Wen Chen | 2006-10-17 |
| 7061079 | Chip package structure and manufacturing method thereof | Shih-Chang Lee, Cheng-Yin Lee | 2006-06-13 |
| 6815833 | Flip chip package | Shih-Chang Lee, Wei-Chang Tai, Cheng-Yin Lee | 2004-11-09 |
| 6465277 | Molding apparatus and molding method for flexible substrate based package | Shih-Chang Lee | 2002-10-15 |
| 6257857 | Molding apparatus for flexible substrate based package | Shih-Chang Lee | 2001-07-10 |