Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7432127 | Chip package and package process thereof | Yung-Li Lu, Gwo-Liang Weng | 2008-10-07 |
| 7187067 | Sensor chip packaging structure | Gwo-Liang Weng, Yung-Li Lu | 2007-03-06 |
| 7122757 | Contact sensor package structure | Shih-Chang Lee, Cheng-Yin Lee, Yung-Li Lu, Pei-Chi Lin | 2006-10-17 |
| 7049689 | Chip on glass package | Chih-Huang Chang, Yung-Li Lu | 2006-05-23 |