Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7589408 | Stackable semiconductor package | Gwo-Liang Weng, Cheng-Yin Lee | 2009-09-15 |
| 7550832 | Stackable semiconductor package | Gwo-Liang Weng | 2009-06-23 |
| 7547962 | Chip package with a ring having a buffer groove that surrounds the active region of a chip | Gwo-Liang Weng | 2009-06-16 |
| 7432127 | Chip package and package process thereof | Gwo-Liang Weng, Ying-Tsai Yeh | 2008-10-07 |
| 7365427 | Stackable semiconductor package | Gwo-Liang Weng | 2008-04-29 |
| 7187067 | Sensor chip packaging structure | Gwo-Liang Weng, Ying-Tsai Yeh | 2007-03-06 |
| 7126221 | Semiconductor package | Gwo-Liang Weng, Chi-Chih Chu, Shih-Chang Lee | 2006-10-24 |
| 7122757 | Contact sensor package structure | Shih-Chang Lee, Cheng-Yin Lee, Ying-Tsai Yeh, Pei-Chi Lin | 2006-10-17 |
| 7122893 | Semiconductor package structure | Gwo-Liang Weng, Ching-Hui Chang, Yu-Wen Chen | 2006-10-17 |
| 7049689 | Chip on glass package | Ying-Tsai Yeh, Chih-Huang Chang | 2006-05-23 |