Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791280 | Semiconductor device package and method of manufacturing the same | Li-Hua Tai, Yun-Chih FEI, Wen-Pin Huang, Sheng-Hong Zheng | 2023-10-17 |
| 11107774 | Semiconductor device package and method of manufacturing the same | Li-Hua Tai, Yun-Chih FEI, Wen-Pin Huang, Sheng-Hong Zheng | 2021-08-31 |
| 7911056 | Substrate structure having N-SMD ball pads | Yu-Hsin Lee | 2011-03-22 |
| 7728441 | Method for mounting a semiconductor package onto PCB | Hsin-Fu Chuang | 2010-06-01 |
| 7662709 | Surface mounting method | Wen-Shin Lin, Sheng-Hong Cheng, Yu-Hsin Lee, Ming-Chia Hsieh, Kuan-Hung Yeh +2 more | 2010-02-16 |
| 7365422 | Package of leadframe with heatsinks | Jun Liu, Kenneth Kinhang Ku, Yu-Li Chung | 2008-04-29 |
| 7357294 | Method for mounting a semiconductor package onto PCB | Hsin-Fu Chuang | 2008-04-15 |
| 7180181 | Mesh shaped dam mounted on a substrate | Sheng Liu, Wei-Chang Tai | 2007-02-20 |
| 6088109 | System for detecting the presence of deposited metals on soldering points of an integrated circuit board substrate | — | 2000-07-11 |