Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10074586 | Thermal dissipation device and semiconductor package device including the same | Pin Hung Chiu, Shu-Ling Su, Yi-Tzu Lin | 2018-09-11 |
| 7365422 | Package of leadframe with heatsinks | Pai-Chou Liu, Jun Liu, Kenneth Kinhang Ku | 2008-04-29 |