Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9735132 | Semiconductor package | Cheng-Yu Yang | 2017-08-15 |
| 8569885 | Stacked semiconductor packages and related methods | — | 2013-10-29 |
| 8405212 | Semiconductor package | Chi-Chih Chu | 2013-03-26 |
| 8198131 | Stackable semiconductor device packages | Chi-Chih Chu, Chien-Yuan Tseng | 2012-06-12 |
| 8076765 | Stackable semiconductor device packages including openings partially exposing connecting elements, conductive bumps, or conductive conductors | Kuang-Hsiung Chen, Chi-Chih Shen, Jen-Chuan Chen, Wen-Hsiung Chang, Hui-Shan Chang +5 more | 2011-12-13 |
| 8012797 | Method for forming stackable semiconductor device packages including openings with conductive bumps of specified geometries | Chi-Chih Shen, Jen-Chuan Chen, Wen-Hsiung Chang, Chi-Chih Chu | 2011-09-06 |
| 7838334 | Package-on-package device, semiconductor package and method for manufacturing the same | Lin-Wang Yu | 2010-11-23 |