Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7012334 | Semiconductor chip with bumps and method for manufacturing the same | Chih-Chiang Liu, Kuo Lung Wang, Che Hsiung Chen | 2006-03-14 |
| 6768332 | Semiconductor wafer and testing method for the same | Yueh-Lung Lin, Ho-Ming Tong, Yao-Hsin Feng, Su Tao, Kuo-Pin Yang +1 more | 2004-07-27 |