Issued Patents All Time
Showing 51–62 of 62 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7425468 | Method for making flip chip on leadframe package | Chien Liu, Tsan-Sheng Huang | 2008-09-16 |
| 7375435 | Chip package structure | Chih-Ming Chung | 2008-05-20 |
| 7368806 | Flip chip package with anti-floating structure | Chien Liu, Sheng-Tai Tsai | 2008-05-06 |
| 7253508 | Semiconductor package with a flip chip on a solder-resist leadframe | Chien Liu, Hsueh-Te Wang, Chi-Hao Chiu, Tai-Yuan Huang | 2007-08-07 |
| 7250676 | Multi-package module with heat spreader | — | 2007-07-31 |
| 7164202 | Quad flat flip chip package and leadframe thereof | Hsueh-Te Wang, Chien Liu, Chi-Hao Chiu | 2007-01-16 |
| 7067904 | Flip-chip type quad flat package and leadframe | Hsueh-Te Wang, Chi-Hao Chiu, Chien Liu | 2006-06-27 |
| 7041531 | Method of fabricating flip chip ball grid array package | — | 2006-05-09 |
| 7022551 | Quad flat flip chip packaging process and leadframe therefor | Hsueh-Te Wang, Chien Liu, Chi-Hao Chiu | 2006-04-04 |
| 6856027 | Multi-chips stacked package | — | 2005-02-15 |
| 6833993 | Multichip package | — | 2004-12-21 |
| 6825567 | Face-to-face multi-chip flip-chip package | Yu-Wen Chen | 2004-11-30 |