Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12068259 | Semiconductor device package and method of manufacturing the same | Wei-Da Lin, Meng-Jen Wang, Wen Jin Huang | 2024-08-20 | $8,555,000 |
| 12009313 | Semiconductor package shielding structure | Meng-Jen Wang, Chien-Yuan Tseng, Ying WEI, Chia-Feng Hsu, Yuan-Long Chiao | 2024-06-11 | $2,117,000 |
| 11605598 | Semiconductor device package and method of manufacturing the same | Wei-Da Lin, Meng-Jen Wang, Wen Jin Huang | 2023-03-14 | $2,598,000 |