Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device package and method for manufacturing the same

Semiconductor device package and method for manufacturing the same

US Patent 10522505 · Granted Dec 31, 2019

Estimated economic value: $1,815,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor package with integrated antenna and shielding pillars2025
Sol-gel vaults and methods of making and using thereof2025
Method and electronic device for motion prediction2025
Heat sink and communication device2025
Test method for combination of touch sensitive processing apparatus and touch pa2025
Semiconductor device package and method for manufacturing the same2025
Semiconductor device package and method for manufacturing the same2025
Semiconductor device package and method for manufacturing the same2025
Semiconductor device package and method for manufacturing the same2025
Heat sink and communication device2025
Multimedia information processing method and apparatus, and storage medium2024
Semiconductor device package and method of manufacturing the same2024