Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7417322 | Multi-chip module with embedded package and method for manufacturing the same | — | 2008-08-26 |
| 7218006 | Multi-chip stack package | Chin-Hsien Lin | 2007-05-15 |
| 7026709 | Stacked chip-packaging structure | Yu-Fang Tsai, Tsung-Yueh Tsai | 2006-04-11 |
| 7015065 | Manufacturing method of ball grid array package | Yu-Fang Tsai, Tsung-Yueh Tsai | 2006-03-21 |