Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8994156 | Semiconductor device packages with solder joint enhancement elements | Ping Hu, Yu-Fang Tsai | 2015-03-31 |
| 8502363 | Semiconductor device packages with solder joint enhancement element and related methods | Ping Hu, Yu-Fang Tsai | 2013-08-06 |
| 8237250 | Advanced quad flat non-leaded package structure and manufacturing method thereof | Pao-Huei Chang Chien, Ping Hu, Wei-Lun Cheng | 2012-08-07 |
| 8124447 | Manufacturing method of advanced quad flat non-leaded package | Pao-Huei Chang Chien, Ping Hu, Wei-Lun Cheng | 2012-02-28 |
| 8106492 | Semiconductor package and manufacturing method thereof | Pao-Huei Chang Chien, Ping Hu, Wei-Lun Cheng | 2012-01-31 |