Issued Patents All Time
Showing 26–50 of 77 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6846719 | Process for fabricating wafer bumps | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more | 2005-01-25 |
| 6838762 | Water-level package with bump ring | Kuo-Chung Yee, Jen-Chieh Kao, Chih-Lung Chen, Hsing-Jung Liau | 2005-01-04 |
| 6822324 | Wafer-level package with a cavity and fabricating method thereof | Kuo-Chung Yee, Jen-Chieh Kao, Chih-Lung Chen, Hsing-Jung Liau | 2004-11-23 |
| 6819002 | Under-ball-metallurgy layer | William T. Chen, Ho-Ming Tong, Chun-Chi Lee, Jeng-Da Wu, Chih-Huang Chang +1 more | 2004-11-16 |
| 6809852 | Microsystem package structure | Kuo-Chung Yee, Jen-Chieh Kao, Chih-Lung Chen, Hsing-Jung Liau | 2004-10-26 |
| 6768207 | Multichip wafer-level package and method for manufacturing the same | Kuo-Chung Yee, Jen-Chieh Kao, Chih-Lung Chen, Hsing-Jung Liau | 2004-07-27 |
| 6768332 | Semiconductor wafer and testing method for the same | Yueh-Lung Lin, Ho-Ming Tong, Yao-Hsin Feng, Chi Cheng Pan, Kuo-Pin Yang +1 more | 2004-07-27 |
| 6756256 | Method for preventing burnt fuse pad from further electrical connection | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more | 2004-06-29 |
| 6732912 | Solder ball attaching process | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more | 2004-05-11 |
| 6720244 | Bump fabrication method | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more | 2004-04-13 |
| 6713320 | Bumping process | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more | 2004-03-30 |
| 6692581 | Solder paste for fabricating bump | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Ching-Fu Horng, Shih-Kuang Chen +5 more | 2004-02-17 |
| 6693364 | Optical integrated circuit element package and process for making the same | Kuo-Chung Yee, Jen-Chieh Kao, Chih-Lung Chen, Hsing-Jung Liau | 2004-02-17 |
| 6664128 | Bump fabrication process | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +4 more | 2003-12-16 |
| 6617237 | Lead-free bump fabrication process | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more | 2003-09-09 |
| 6610924 | Semiconductor package | Shih-Chang Lee | 2003-08-26 |
| 6573123 | Semiconductor chip package and manufacturing method thereof | Sai LI, Chun-Hung Lin, Shin-Hua Chao | 2003-06-03 |
| 6534852 | Ball grid array semiconductor package with improved strength and electric performance and method for making the same | Chun-Hung Lin, I Lee, Kun-Ching Chen | 2003-03-18 |
| 6528393 | Method of making a semiconductor package by dicing a wafer from the backside surface thereof | — | 2003-03-04 |
| 6462421 | Multichip module | Kao-Yu Hsu | 2002-10-08 |
| 6461897 | Multichip module having a stacked chip arrangement | Chun-Hung Lin, Kuang-Hui Chen, Shyh-Wei Wang | 2002-10-08 |
| 6392424 | Press plate of wire bond checking system | Chin-Chen Wang, Yao-Hsin Feng | 2002-05-21 |
| 6369439 | Strip of semiconductor package | Kuo-Pin Yang, Tai-Chun Huang | 2002-04-09 |
| 6359340 | Multichip module having a stacked chip arrangement | Chun-Hung Lin, Kuang-Hui Chen, Shyh-Wei Wang, Jian Chen | 2002-03-19 |
| 6348729 | Semiconductor chip package and manufacturing method thereof | Sai LI, Chun-Hung Lin, Shin-Hua Chao | 2002-02-19 |