Issued Patents All Time
Showing 51–75 of 77 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6342443 | Method and structure for forming flip chip with collapse-controlled solder bumps on a substrate | Wei-Chung Wang, Jen-Kuang Fang | 2002-01-29 |
| 6316828 | Structure of a solder mask for the circuit module of a BGA substrate | Tao-Yu Chen, Kao-Yu Hsu | 2001-11-13 |
| 6312976 | Method for manufacturing leadless semiconductor chip package | Chun-Hung Lin, Chun-Chi Lee | 2001-11-06 |
| 6313413 | Wire structure of substrate for layout detection | Kun-Ching Chen, Yire-Zine Lee, Yung-I Yeh | 2001-11-06 |
| 6300166 | Method for packaging a BGA and the structure of a substrate for use with the method | Yu-Ching Tsai, Meng-Hui Lin, Chin-Ming Chung | 2001-10-09 |
| 6265768 | Chip scale package | Ching-Huei Su | 2001-07-24 |
| 6258626 | Method of making stacked chip package | Hsueh-Te Wang | 2001-07-10 |
| 6252305 | Multichip module having a stacked chip arrangement | Chun-Hung Lin, Kuang-Hui Chen, Shyh-Wei Wang | 2001-06-26 |
| 6229702 | Ball grid array semiconductor package having improved heat dissipation efficiency, overall electrical performance and enhanced bonding capability | Chin-Long Wu, Tai-Chun Huang, Han-Hsiang Huang, Shih-Kuang Chen, Shin-Hua Chao | 2001-05-08 |
| 6215193 | Multichip modules and manufacturing method therefor | Meng-Hui Lin | 2001-04-10 |
| 6211574 | Semiconductor package with wire protection and method therefor | Chun-Hung Lin, Tai-Chun Huang | 2001-04-03 |
| 6204559 | Ball grid assembly type semiconductor package having improved chip edge support to prevent chip cracking | Chun-Hung Lin, Yire-Zine Lee, Jian Chen | 2001-03-20 |
| 6201299 | Substrate structure of BGA semiconductor package | Chih-Ming Chung, Jian-Cheng Chen, Chun-Chi Lee | 2001-03-13 |
| 6191360 | Thermally enhanced BGA package | Han-Hsiang Huang, Kun-Ching Chen, Chun-Chi Lee | 2001-02-20 |
| 6190529 | Method for plating gold to bond leads on a semiconductor substrate | Yei-Shen Wu, Kun-Ching Chen | 2001-02-20 |
| 6176416 | Method of making low-profile wire connection | Yu-Fang Tsai | 2001-01-23 |
| 6176417 | Ball bonding method on a chip | Yu-Fang Tsai, Simon Lee, Tao-Yu Chen | 2001-01-23 |
| 6172318 | Base for wire bond checking | Chin-Chen Wang, Yao-Hsin Feng | 2001-01-09 |
| 6161753 | Method of making a low-profile wire connection for stacked dies | Yu-Fang Tsai, Sung-Fei Wang, Meng-Hui Lin | 2000-12-19 |
| 6153939 | Flip-chip semiconductor device with enhanced reliability and manufacturing efficiency, and the method for under filling the same | Wei-Chung Wang, Hsueh-Te Wang, Jen-Kuang Fang | 2000-11-28 |
| 6150730 | Chip-scale semiconductor package | Chih-Ming Chung, Kuo-Pin Yang, Jen-Kuang Fang | 2000-11-21 |
| 6135522 | Sucker for transferring packaged semiconductor device | Jau-Yuen Su | 2000-10-24 |
| 6118176 | Stacked chip assembly utilizing a lead frame | Kuang-Lin Lo, Kuang-Chun Chou, Shih-Chih Chen | 2000-09-12 |
| 6093960 | Semiconductor package having a heat spreader capable of preventing being soldered and enhancing adhesion and electrical performance | Kuang-Lin Lo, Hsin-Hsing Wei | 2000-07-25 |
| 6048184 | Back-pressure sealing system for revolving compressor | Yu-Choung Chang, Tse-Liang Hsiao, Kun-I Liang, Chun-Chung Yang, Ann Huang +1 more | 2000-04-11 |