Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12293141 | Integrated circuit stack verification method and system for performing the same | Feng-Wei Kuo, Shuo-Mao Chen, Chin-Yuan Huang, Ho-Hsiang Chen, Chewn-Pu Jou | 2025-05-06 |
| 11675957 | Integrated circuit stack verification method and system for performing the same | Feng-Wei Kuo, Shuo-Mao Chen, Chin-Yuan Huang, Ho-Hsiang Chen, Chewn-Pu Jou | 2023-06-13 |
| 11387177 | Package structure and method for forming the same | Chin-Her Chien, Po-Hsiang Huang, Cheng-Hung Yeh, TAI-YU WANG, MING-KE TSAI +6 more | 2022-07-12 |
| 11023647 | Integrated circuit stack verification method and system for performing the same | Feng-Wei Kuo, Shuo-Mao Chen, Chin-Yuan Huang, Ho-Hsiang Chen, Chewn-Pu Jou | 2021-06-01 |
| 9922160 | Integrated circuit stack verification method and system for performing the same | Feng-Wei Kuo, Shuo-Mao Chen, Chin-Yuan Huang, Ho-Hsiang Chen, Chewn-Pu Jou | 2018-03-20 |
| 8359554 | Verification of 3D integrated circuits | Chung-Hsing Wang, Chih Sheng Tsai, Ying-Lin Liu | 2013-01-22 |
| 8060843 | Verification of 3D integrated circuits | Chung-Hsing Wang, Chih Sheng Tsai, Ying-Lin Liu | 2011-11-15 |