Issued Patents All Time
Showing 26–28 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7550836 | Structure of package on package and method for fabricating the same | Chi-Tsung Chiu | 2009-06-23 |
| 7445944 | Packaging substrate and manufacturing method thereof | Ho-Ming Tong, Teck-Chong Lee, Chao-Fu Weng, Chian-Chi Lin, Shin-Hua Chao +2 more | 2008-11-04 |
| 7193282 | Contact sensor package | Gwo-Liang Weng, Shih-Chang Lee | 2007-03-20 |