Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor package structure having an annular frame with truncated corners

Semiconductor package structure having an annular frame with truncated corners

US Patent 11171113 · Granted Nov 9, 2021

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor package structure2025
Semiconductor package structure2025
Electronic package with rotated semiconductor die2025
Electronic package with rotated semiconductor die2025
Semiconductor package structure and method for forming the same2025
Integrated fan-out package, package-on-package structure, and manufacturing meth2025
Semiconductor package with dummy MIM capacitor die2024
Semiconductor package with dummy MIM capacitor die2024
Semiconductor package structure having an annular frame with truncated corners2024
Semiconductor package structure having an annular frame with truncated corners2024
Semiconductor package structure having an annular frame with truncated corners2024
Semiconductor package structure having an annular frame with truncated corners2024