Issued Patents All Time
Showing 26–50 of 99 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11081453 | Semiconductor package structure with antenna | Nai-Wei Liu, Yen-Yao Chi, Yeh-Chun Kao, Shih-Huang Yeh, Wen-Sung Hsu | 2021-08-03 |
| 11043730 | Fan-out package structure with integrated antenna | Nai-Wei Liu, Yen-Yao Chi, Wen-Sung Hsu | 2021-06-22 |
| 11024954 | Semiconductor package with antenna and fabrication method thereof | Nai-Wei Liu, Yen-Yao Chi, Wen-Sung Hsu | 2021-06-01 |
| 10957611 | Semiconductor package including lid structure with opening and recess | Chia-Cheng Chang, I-Hsuan Peng, Nai-Wei Liu | 2021-03-23 |
| 10903198 | Semiconductor package assembly and method for forming the same | Chia-Cheng Chang, I-Hsuan Peng | 2021-01-26 |
| 10784211 | Semiconductor package structure | Chia-Cheng Chang, I-Hsuan Peng, Nai-Wei Liu | 2020-09-22 |
| 10727202 | Package structure | Yu-Hua Huang, Wei-Che Huang, Ming-Tzong Yang | 2020-07-28 |
| 10707183 | Flip chip package utilizing trace bump trace interconnection | Thomas Matthew Gregorich | 2020-07-07 |
| 10692789 | Stacked fan-out package structure | Nai-Wei Liu, I-Hsuan Peng, Ching-Wen Hsiao, Wei-Che Huang | 2020-06-23 |
| 10673813 | Method for NAT traversal in VPN | Hsueh-Ming Hang, Shaw Hwa Hwang, Cheng Yu YEH, Bing Chih YAO, Kuan-Lin Chen +6 more | 2020-06-02 |
| 10580747 | Semiconductor package and method for fabricating base for semiconductor package | Wen-Sung Hsu, Ta-Jen Yu, Andrew C. Chang | 2020-03-03 |
| 10573616 | Semiconductor package and method for fabricating base for semiconductor package | Wen-Sung Hsu, Ta-Jen Yu, Andrew C. Chang | 2020-02-25 |
| 10573615 | Semiconductor package and method for fabricating base for semiconductor package | Wen-Sung Hsu, Ta-Jen Yu, Andrew C. Chang | 2020-02-25 |
| 10553526 | Semiconductor package | Wen-Sung Hsu, Ta-Jen Yu | 2020-02-04 |
| 10497689 | Semiconductor package assembly and method for forming the same | Chia-Cheng Chang, I-Hsuan Peng | 2019-12-03 |
| 10483211 | Fan-out package structure and method for forming the same | I-Hsuan Peng, Ching-Wen Hsiao, Nai-Wei Liu, Wei-Che Huang | 2019-11-19 |
| 10468341 | Semiconductor package assembly | Nai-Wei Liu, I-Hsuan Peng, Che-Hung Kuo, Che-Ya Chou, Wei-Che Huang | 2019-11-05 |
| 10431564 | Structure and formation method of chip package structure | — | 2019-10-01 |
| 10424563 | Semiconductor package assembly and method for forming the same | I-Hsuan Peng, Ching-Wen Hsiao | 2019-09-24 |
| 10410969 | Semiconductor package assembly | Chia-Cheng Chang, I-Hsuan Peng | 2019-09-10 |
| 10361173 | Semiconductor package assemblies with system-on-chip (SOC) packages | Ming-Tzong Yang | 2019-07-23 |
| 10354970 | Flip chip package utilizing trace bump trace interconnection | Thomas Matthew Gregorich | 2019-07-16 |
| 10332830 | Semiconductor package assembly | Ming-Tzong Yang, Wei-Che Huang | 2019-06-25 |
| 10256210 | Semiconductor package structure and method for forming the same | Ching-Wen Hsiao, I-Hsuan Peng | 2019-04-09 |
| 10217724 | Semiconductor package assembly with embedded IPD | I-Hsuan Peng, Ching-Wen Hsiao | 2019-02-26 |