Issued Patents All Time
Showing 76–99 of 99 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9620580 | Semiconductor structure | Cheng-Chou Hung | 2017-04-11 |
| 9607951 | Chip package | Uming Ko, Tai-Yu Chen | 2017-03-28 |
| 9609211 | Method of image conversion operation for panorama dynamic IP camera | Shaw Hwa Hwang, Bing Chih YAO, Kuan-Lin Chen, Yao Hsing CHUNG, Chi Jung HUANG +6 more | 2017-03-28 |
| 9570399 | Semiconductor package assembly with through silicon via interconnect | Ming-Tzong Yang, Cheng-Chou Hung, Wei-Che Huang, Yu-Hua Huang, Kuei-Ti Chan +2 more | 2017-02-14 |
| 9553040 | Semiconductor package | Wen-Sung Hsu, Ta-Jen Yu | 2017-01-24 |
| 9548271 | Semiconductor package | Kuei-Ti Chan, Ching-Liou Huang | 2017-01-17 |
| 9548289 | Semiconductor package assemblies with system-on-chip (SOC) packages | Ming-Tzong Yang | 2017-01-17 |
| 9543232 | Semiconductor package structure and method for forming the same | Cheng-Chou Hung, Ming-Tzong Yang, Tung-Hsing Lee, Wei-Che Huang, Yu-Hua Huang | 2017-01-10 |
| 9524948 | Package structure | Yu-Hua Huang, Wei-Che Huang, Ming-Tzong Yang | 2016-12-20 |
| 9520349 | Semiconductor package | Wen-Sung Hsu, Ta-Jen Yu | 2016-12-13 |
| 9437512 | Integrated circuit package structure | Thomas Matthew Gregorich | 2016-09-06 |
| 9437534 | Enhanced flip chip structure using copper column interconnect | Thomas Matthew Gregorich, Che-Ya Chou | 2016-09-06 |
| 9209148 | Semiconductor package | Kuei-Ti Chan, Ching-Liou Huang | 2015-12-08 |
| 9177899 | Semiconductor package and method for fabricating base for semiconductor package | Wen-Sung Hsu, Ta-Jen Yu, Andrew C. Chang | 2015-11-03 |
| 9142526 | Semiconductor package with solder resist capped trace to prevent underfill delamination | Ching-Liou Huang, Thomas Matthew Gregorich | 2015-09-22 |
| 9064757 | Enhanced flip chip structure using copper column interconnect | Thomas Matthew Gregorich, Che-Ya Chou | 2015-06-23 |
| 9040359 | Molded interposer package and method for fabricating the same | Thomas Matthew Gregorich, Andrew C. Chang | 2015-05-26 |
| 9042376 | Traversal method for ICMP-sensitive NAT | Shaw Hwa Hwang, Bing Chih YAO, Chao Ping CHU, Ning Yun KU, Ming Che YEH | 2015-05-26 |
| 8987897 | Semiconductor package | Kuei-Ti Chan, Ching-Liou Huang | 2015-03-24 |
| 8957518 | Molded interposer package and method for fabricating the same | Thomas Matthew Gregorich, Andrew C. Chang | 2015-02-17 |
| 8859340 | Molded interposer package and method for fabricating the same | Thomas Matthew Gregorich, Andrew C. Chang | 2014-10-14 |
| 8633588 | Semiconductor package | Ching-Liou Huang, Thomas Matthew Gregorich | 2014-01-21 |
| 8502377 | Package substrate for bump on trace interconnection | Ching-Liou Huang, Thomas Matthew Gregorich | 2013-08-06 |
| 8390119 | Flip chip package utilizing trace bump trace interconnection | Thomas Matthew Gregorich | 2013-03-05 |