Issued Patents All Time
Showing 26–31 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11282717 | Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap | Ziyin Lin, Vipul V. Mehta, Yuying Wei, Sushrutha Gujjula, Nisha Ananthakrishnan +1 more | 2022-03-22 |
| 10290561 | Thermal interfaces for integrated circuit packages | Omkar G. Karhade, Kedar Dhane, Chandra Mohan Jha | 2019-05-14 |
| 10192810 | Underfill material flow control for reduced die-to-die spacing in semiconductor packages | Omkar G. Karhade, Nitin A. Deshpande, Rajendra C. Dias, Lars D. Skoglund | 2019-01-29 |
| 9741692 | Methods to form high density through-mold interconnections | Omkar G. Karhade, Nitin A. Deshpande, Eric J. Li, Debendra Mallik, Bassam M. Ziadeh | 2017-08-22 |
| 9477275 | Thermal management solution for circuit products | Arnab Choudhury, Je-Young Chang, David W. Song, Ashish Gupta | 2016-10-25 |
| 8951846 | Controlling thermal interface material bleed out | Gopi Krishnan, Mingjie Xu, Sung Won Moon | 2015-02-10 |