Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Coated probe tips for plunger pins of an integrated circuit package test system

Coated probe tips for plunger pins of an integrated circuit package test system

US Patent 10168357 · Granted Jan 1, 2019

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

BGA stiffener attachment with low Eolife adhesive strength at high solder joint 2025
Omni directional interconnect with magnetic fillers in mold matrix2025
Methods and apparatus to reduce defects in interconnects between semiconductor d2025
Clock circuit in a processor integrated circuit2025
Method to enable 30 microns pitch EMIB or below2025
Package substrate z-disaggregation with liquid metal interconnects2025
Flushing switch device with automatic pressing stroke detection2025
Array substrate, method for fabricating same, and display panel2025
Package comprising an integrated device with a back side metal layer2024
Dummy die structures of a packaged integrated circuit device2024
Selectively roughened copper architectures for low insertion loss conductive fea2024
Patternable die attach materials and processes for patterning2024