Issued Patents All Time
Showing 26–28 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7638867 | Microelectronic package having solder-filled through-vias | Dale Hackitt | 2009-12-29 |
| 7557036 | Method, system, and apparatus for filling vias | Amram Eitan | 2009-07-07 |
| 6492308 | Post chemical-mechanical planarization (CMP) cleaning composition | Shahriar Naghshineh, Jeff Barnes | 2002-12-10 |