Issued Patents All Time
Showing 51–75 of 187 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532574 | Through-substrate waveguide | Aleksandar Aleksov, Georgios Dogiamis, Gilbert Dewey, Hyung-Jin Lee | 2022-12-20 |
| 11525970 | Microelectronic package communication using radio interfaces connected through wiring | Shawna M. Liff, Adel A. Elsherbini, Sasha N. Oster, Gaurav Chawla | 2022-12-13 |
| 11509069 | Distributed on-package millimeter-wave radio | Adel A. Elsherbini | 2022-11-22 |
| 11476554 | Mmwave waveguide to waveguide connectors for automotive applications | Georgios Dogiamis, Sasha N. Oster, Erich N. Ewy, Adel A. Elsherbini, Johanna M. Swan | 2022-10-18 |
| 11462810 | Multiplexer and combiner structures embedded in a mmwave connector interface | Sasha N. Oster, Georgios Dogiamis, Johanna M. Swan | 2022-10-04 |
| 11456721 | RF front end module including hybrid filter and active circuits in a single package | Feras Eid, Georgios Dogiamis, Vijay K. Nair, Johanna M. Swan | 2022-09-27 |
| 11437693 | Mmwave waveguides featuring power-over-waveguide technology for automotive applications | Georgios Dogiamis, Sasha N. Oster, Kenneth D. Shoemaker, Erich N. Ewy, Adel A. Elsherbini +1 more | 2022-09-06 |
| 11437706 | Package with side-radiating wave launcher and waveguide | Georgios Dogiamis, Aleksandar Aleksov, Gilbert Dewey, Hyung-Jin Lee | 2022-09-06 |
| 11430751 | Microelectronic devices designed with 3D stacked ultra thin package modules for high frequency communications | Aleksandar Aleksov, Georgios Dogiamis, Sasha N. Oster | 2022-08-30 |
| 11394094 | Waveguide connector having a curved array of waveguides configured to connect a package to excitation elements | Sasha N. Oster, Georgios Dogiamis, Adel A. Elsherbini, Shawna M. Liff, Aleksandar Aleksov +2 more | 2022-07-19 |
| 11387200 | Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabric | Georgios Dogiamis, Javier A. Falcon, Yoshihiro Tomita, Vijay K. Nair | 2022-07-12 |
| 11367937 | Waveguides with active or passive repeaters for range extension | Georgios Dogiamis, Sasha N. Oster | 2022-06-21 |
| 11367708 | Microelectronic devices designed with efficient partitioning of high frequency communication devices integrated on a package fabric | Vijay K. Nair, Georgios Dogiamis | 2022-06-21 |
| 11335651 | Microelectronic devices designed with compound semiconductor devices and integrated on an inter die fabric | Georgios Dogiamis, Vijay K. Nair, Javier A. Falcon, Shawna M. Liff, Yoshihiro Tomita | 2022-05-17 |
| 11329359 | Dielectric waveguide including a dielectric material with cavities therein surrounded by a conductive coating forming a wall for the cavities | Georgios Dogiamis, Adel A. Elsherbini, Henning Braunisch, Johanna M. Swan | 2022-05-10 |
| 11328986 | Capacitor-wirebond pad structures for integrated circuit packages | Aleksandar Aleksov, Feras Eid, Georgios Dogiamis, Johanna M. Swan | 2022-05-10 |
| 11316497 | Multi-filter die | Georgios Dogiamis, Aleksandar Aleksov, Feras Eid, Johanna M. Swan | 2022-04-26 |
| 11310907 | Microelectronic package with substrate-integrated components | Georgios Dogiamis, Aleksandar Aleksov, Feras Eid, Johanna M. Swan | 2022-04-19 |
| 11309619 | Waveguide coupling systems and methods | Sasha N. Oster, Georgios Dogiamis, Adel A. Elsherbini, Shawna M. Liff, Aleksandar Aleksov +1 more | 2022-04-19 |
| 11283427 | Hybrid filters and packages therefor | Feras Eid, Georgios Dogiamis, Vijay K. Nair, Johanna M. Swan | 2022-03-22 |
| 11251512 | Pluggable MM-wave module for rack scale architecture (RSA) servers and high performance computers (HPCS) | Georgios Dogiamis, Sasha N. Oster | 2022-02-15 |
| 11244912 | Semiconductor package having a coaxial first layer interconnect | Sai Vadlamani, Aleksandar Aleksov, Rahul Jain, Kyu Oh Lee, Kristof Darmawikarta +2 more | 2022-02-08 |
| 11227825 | High performance integrated RF passives using dual lithography process | Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, William J. Lambert, Robert L. Sankman +6 more | 2022-01-18 |
| 11211345 | In-package RF waveguides as high bandwidth chip-to-chip interconnects and methods for using the same | Aleksandar Aleksov, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Eyal Fayneh, Ofir Degani +2 more | 2021-12-28 |
| 11206008 | Hybrid filter architecture with integrated passives, acoustic wave resonators and hermetically sealed cavities between two resonator dies | Georgios Dogiamis, Feras Eid, Vijay K. Nair, Johanna M. Swan | 2021-12-21 |