TK

Telesphor Kamgaing

IN Intel: 187 patents #68 of 30,777Top 1%
📍 Chandler, AZ: #6 of 3,331 inventorsTop 1%
🗺 Arizona: #38 of 32,909 inventorsTop 1%
Overall (All Time): #3,876 of 4,157,543Top 1%
187
Patents All Time

Issued Patents All Time

Showing 101–125 of 187 patents

Patent #TitleCo-InventorsDate
10886606 Microelectronic devices designed with flexible package substrates with distributed stacked antennas for high frequency communication systems Sasha N. Oster, Georgios Dogiamis 2021-01-05
10887439 Microelectronic devices designed with integrated antennas on a substrate Georgios Dogiamis, Vijay K. Nair 2021-01-05
10868357 Massive antenna array architecture for base stations designed for high frequency communications Georgios Dogiamis, Sasha N. Oster 2020-12-15
10852495 Microelectronic package communication using radio interfaces connected through wiring Shawna M. Liff, Adel A. Elsherbini, Sasha N. Oster, Gaurav Chawla 2020-12-01
10847889 Patch antenna with isolated feeds Adewale K Oladeinde 2020-11-24
10819445 Waveguide and transceiver interference mitigation Georgios Dogiamis, Henning Braunisch, Hyung-Jin Lee, Richard J. Dischler 2020-10-27
10804227 Semiconductor packages with antennas Adel A. Elsherbini, Sasha N. Oster 2020-10-13
10777538 System on package architecture including structures on die back side Fay Hua, Johanna M. Swan 2020-09-15
10734236 Electronic devices with components formed by late binding using self-assembled monolayers Sasha N. Oster, Fay Hua, Adel A. Elsherbini, Henning Braunisch, Johanna M. Swan 2020-08-04
10734735 Distributed on-package millimeter-wave radio Adel A. Elsherbini 2020-08-04
10680788 Waveguide communication with increased link data rate Georgios Dogiamis, Emanuel Cohen, Sasha N. Oster 2020-06-09
10658312 Embedded millimeter-wave phased array module Adel A. Elsherbini, Valluri Rao 2020-05-19
10629551 Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabric Georgios Dogiamis, Javier A. Falcon, Yoshihiro Tomita, Vijay K. Nair 2020-04-21
10623106 Orthogonal frequency division multiplexing single sideband transmission over a waveguide Hyung-Jin Lee, Cho-Ying Lu, Henning Braunisch, Georgios Dogiamis, Richard J. Dischler 2020-04-14
10615133 Die package with superposer substrate for passive components Valluri Rao 2020-04-07
10593636 Platform with thermally stable wireless interconnects Georgios Dogiamis, Sasha N. Oster, Adel A. Elsherbini, Brandon M. Rawlings, Feras Eid 2020-03-17
10594294 Piezoelectric package-integrated delay lines Adel A. Elsherbini, Feras Eid, Baris Bicen, Vijay K. Nair, Georgios Dogiamis +2 more 2020-03-17
10595410 Non-planar on-package via capacitor Fay Hua, Brandon M. Rawlings, Georgios Dogiamis 2020-03-17
10573608 Microelectronic devices designed with high frequency communication devices including compound semiconductor devices integrated on a die fabric on package Georgios Dogiamis, Eric J. Li, Javier A. Falcon, Yoshihiro Tomita, Vijay K. Nair +1 more 2020-02-25
10566672 Waveguide connector with tapered slot launcher Adel A. Elsherbini, Sasha N. Oster, Johanna M. Swan, Georgios Dogiamis, Shawna M. Liff +1 more 2020-02-18
10546835 Microelectronic devices designed with efficient partitioning of high frequency communication devices integrated on a package fabric Vijay K. Nair, Georgios Dogiamis 2020-01-28
10498379 Wireless interconnects on flexible cables between computing platforms Richard J. Dischler 2019-12-03
10484120 Waveguide couplers and junctions to enable frequency division multiplexed sensor systems in autonomous vehicle Sasha N. Oster, Georgios Dogiamis, Adel A. Elsherbini, Johanna M. Swan, Erich N. Ewy 2019-11-19
10477596 Blade computing system with wireless communication between blades within a blade enclosure Rahul Khanna 2019-11-12
10476545 Communication between integrated circuit packages using a millimeter-wave wireless radio fabric Adel A. Elsherbini, Sasha N. Oster, Brandon M. Rawlings, Georgios Dogiamis 2019-11-12