Issued Patents All Time
Showing 151–175 of 187 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10032052 | Piezoelectric package-integrated delay lines for radio frequency identification tags | Adel A. Elsherbini, Feras Eid, Vijay K. Nair, Georgios Dogiamis, Johanna M. Swan +1 more | 2018-07-24 |
| 10033093 | mmWave antennas and transmission lines on standard substrate materials | Adel A. Elsherbini, Sarah Haney | 2018-07-24 |
| 9960849 | Channelization for dispersion limited waveguide communication channels | Georgios Dogiamis, Sasha N. Oster, Emanuel Cohen | 2018-05-01 |
| 9921640 | Integrated voltage regulators with magnetically enhanced inductors | Uwe Zillmann, Andre Schaefer, Ruchir Saraswat, Paul B. Fischer, Guido Droege | 2018-03-20 |
| 9881990 | Integrated inductor for integrated circuit devices | Andreas Duevel, Valluri Rao, Uwe Zillmann | 2018-01-30 |
| 9853359 | Antenna integrated in a package substrate | Adel A. Elsherbini | 2017-12-26 |
| 9820384 | Flexible electronic assembly method | Sasha N. Oster, Robert L. Sankman, Charles A. Gealer, Omkar G. Karhade, John S. Guzek +8 more | 2017-11-14 |
| 9786581 | Through-silicon via (TSV)-based devices and associated techniques and configurations | — | 2017-10-10 |
| 9773742 | Embedded millimeter-wave phased array module | Adel A. Elsherbini, Valluri Rao | 2017-09-26 |
| 9673268 | Integrated inductor for integrated circuit devices | Andreas Duevel, Valluri Rao, Uwe Zillmann | 2017-06-06 |
| 9659904 | Distributed on-package millimeter-wave radio | Adel A. Elsherbini | 2017-05-23 |
| 9653805 | Chip packages including through-silicon via dice with vertically inegrated phased-array antennas and low-frequency and power delivery substrates | Valluri Rao, Georgios Palaskas | 2017-05-16 |
| 9647636 | Piezoelectric package-integrated delay lines for radio frequency identification tags | Adel A. Elsherbini, Feras Eid, Vijay K. Nair, Georgios Dogiamis, Johanna M. Swan +1 more | 2017-05-09 |
| 9620847 | Integration of millimeter wave antennas on microelectronic substrates | — | 2017-04-11 |
| 9543244 | Hybrid package transmission line circuits | Chung Peng Jackson Kong, Chang-Tsung Fu, Chan Kim Lee, Ping Ping Ooi | 2017-01-10 |
| 9505610 | Device, system and method for providing MEMS structures of a semiconductor package | Weng Hong Teh, Tarek A. Ibrahim, Sarah Haney, Daniel N. Sobieski, Parshuram Balkrishna Zantye +1 more | 2016-11-29 |
| 9419339 | Package structures including discrete antennas assembled on a device | Valluri Rao, Ofir Degani | 2016-08-16 |
| 9413079 | Single-package phased array module with interleaved sub-arrays | Adel A. Elsherbini | 2016-08-09 |
| 9406427 | Transformer devices | — | 2016-08-02 |
| 9318952 | Series and parallel hybrid switched capacitor networks for IC power delivery | Bradley Steven Oraw | 2016-04-19 |
| 9229466 | Fully integrated voltage regulators for multi-stack integrated circuit architectures | Ruchir Saraswat, Andre Schaefer, Uwe Zillman, Andreas Duevel, Valluri Rao +1 more | 2016-01-05 |
| 9166284 | Package structures including discrete antennas assembled on a device | Valluri Rao, Ofir Degani | 2015-10-20 |
| 8901688 | High performance glass-based 60 ghz / mm-wave phased array antennas and methods of making same | — | 2014-12-02 |
| 8890302 | Hybrid package transmission line circuits | Chung Peng Jackson Kong, Chang-Tsung Fu, Chan Kim Lee, Ping Ping Ooi | 2014-11-18 |
| 8816906 | Chip packages including through-silicon via dice with vertically inegrated phased-array antennas and low-frequency and power delivery substrates | Valluri Rao, Yorgos Palaskas | 2014-08-26 |