Issued Patents All Time
Showing 26–50 of 187 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12002745 | High performance integrated RF passives using dual lithography process | Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, William J. Lambert, Robert L. Sankman +6 more | 2024-06-04 |
| 11955684 | Components for millimeter-wave communication | Diego Correas-Serrano, Georgios Dogiamis, Henning Braunisch, Neelam Prabhu Gaunkar | 2024-04-09 |
| 11916604 | Dispersion compensation for electromagnetic waveguides | Diego Correas-Serrano, Georgios Dogiamis, Henning Braunisch, Neelam Prabhu Gaunkar, Thomas W. Brown +1 more | 2024-02-27 |
| 11894324 | In-package RF waveguides as high bandwidth chip-to-chip interconnects and methods for using the same | Aleksandar Aleksov, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Eyal Fayneh, Ofir Degani +2 more | 2024-02-06 |
| 11887946 | Semiconductor packages with antennas | Adel A. Elsherbini, Sasha N. Oster | 2024-01-30 |
| 11830831 | Semiconductor package including a modular side radiating waveguide launcher | Georgios Dogiamis, Sasha N. Oster, Johanna M. Swan, Shawna M. Liff, Adel A. Elsherbini +1 more | 2023-11-28 |
| 11830787 | Thermal management in integrated circuit packages | Feras Eid, Georgios Dogiamis, Aleksandar Aleksov, Johanna M. Swan | 2023-11-28 |
| 11784108 | Thermal management in integrated circuit packages | Feras Eid, Georgios Dogiamis, Aleksandar Aleksov, Johanna M. Swan | 2023-10-10 |
| 11764452 | Integrated circuit including a dielectric waveguide with a cavity therein surrounded by a conductive coating forming a wall for the cavity | Georgios Dogiamis, Adel A. Elsherbini, Henning Braunisch, Johanna M. Swan | 2023-09-19 |
| 11737154 | Patch on interposer package with wireless communication interface | — | 2023-08-22 |
| 11728290 | Waveguide fan-out | Adel A. Elsherbini, Georgios Dogiamis, Johanna M. Swan, Aleksandar Aleksov, Henning Braunisch | 2023-08-15 |
| 11716826 | Platforms including microelectronic packages therein coupled to a chassis, where waveguides couple the microelectronic packages to each other and usable in a computing device | Johanna M. Swan, Georgios Dogiamis, Henning Braunisch, Adel A. Elsherbini, Aleksandar Aleksov +1 more | 2023-08-01 |
| 11715693 | Dielectric waveguide channel for interconnecting dies in a semiconductor package usable in a computing device and method of manufacture | Georgios Dogiamis, Aleksandar Aleksov, Adel A. Elsherbini, Henning Braunisch, Johanna M. Swan | 2023-08-01 |
| 11694962 | Microelectronic package with mold-integrated components | Georgios Dogiamis, Aleksandar Aleksov, Feras Eid, Johanna M. Swan | 2023-07-04 |
| 11688660 | Bridge for radio frequency (RF) multi-chip modules | Aleksandar Aleksov, Feras Eid, Georgios Dogiamis, Johanna M. Swan | 2023-06-27 |
| 11658418 | Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems | Feras Eid, Sasha N. Oster, Georgios Dogiamis, Aleksandar Aleksov | 2023-05-23 |
| 11652057 | Disaggregated die interconnection with on-silicon cavity bridge | Khang Choong Yong, Eng Huat Goh, Min Suet Lim, Robert L. Sankman, Wil Choon Song +1 more | 2023-05-16 |
| 11641711 | Microelectronic package with substrate-integrated components | Georgios Dogiamis, Aleksandar Aleksov, Feras Eid, Johanna M. Swan | 2023-05-02 |
| 11621192 | Inorganic dies with organic interconnect layers and related structures | Aleksandar Aleksov, Feras Eid, Georgios Dogiamis, Johanna M. Swan | 2023-04-04 |
| 11605603 | Microelectronic package with radio frequency (RF) chiplet | Adel A. Elsherbini, Georgios Dogiamis, Henning Braunisch, Johanna M. Swan, Shawna M. Liff +1 more | 2023-03-14 |
| 11594801 | Mmwave dielectric waveguide interconnect topology for automotive applications | Georgios Dogiamis, Sasha N. Oster, Erich N. Ewy, Kenneth D. Shoemaker, Adel A. Elsherbini +1 more | 2023-02-28 |
| 11581272 | Contactless high-frequency interconnect | Henning Braunisch, Adel A. Elsherbini, Georgios Dogiamis, Richard J. Dischler, Johanna M. Swan +1 more | 2023-02-14 |
| 11575749 | Low-weight single mm-wave dielectric waveguide interconnect architecture in autonomous cars | Georgios Dogiamis, Sasha N. Oster, Adel A. Elsherbini, Erich N. Ewy, Johanna M. Swan | 2023-02-07 |
| 11562971 | Semiconductor packages with antennas | Adel A. Elsherbini, Sasha N. Oster | 2023-01-24 |
| 11538803 | Integration of III-V transistors in a silicon CMOS stack | Gilbert Dewey, Aleksandar Aleksov, Gerogios Dogiamis, Hyung-Jin Lee | 2022-12-27 |