Issued Patents All Time
Showing 26–50 of 74 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9252111 | Method for handling very thin device wafers | — | 2016-02-02 |
| 9142510 | 3D interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approach | Mark Bohr, Andrew W. Yeoh, Christopher M. Pelto, Hiten Kothari, Seshu V. Sattiraju +1 more | 2015-09-22 |
| 9041146 | Logic chip including embedded magnetic tunnel junctions | Tahir Ghani, Joseph M. Steigerwald, John H. Epple, Yih Wang | 2015-05-26 |
| 9018184 | Inhibitors of SP140 and their use in therapy | David Francis Tough | 2015-04-28 |
| 8994174 | Structure having a planar bonding surface | — | 2015-03-31 |
| 8935620 | Dynamic content management | Daniel Peter Cox, Jeffrey M. Scherpelz, Peter V. Commons | 2015-01-13 |
| 8933564 | Landing structure for through-silicon via | Christopher M. Pelto, Ruth A. Brain, Gerald S. Leatherman | 2015-01-13 |
| 8910927 | Work holding device for an archery bow | Tony James Berry | 2014-12-16 |
| 8887085 | Dynamic content navigation | Daniel Peter Cox, Jeffrey M. Scherpelz, Peter V. Commons | 2014-11-11 |
| 8853757 | Forming thick metal interconnect structures for integrated circuits | — | 2014-10-07 |
| 8704336 | Selective removal of on-die redistribution interconnects from scribe-lines | Jun He, Subhash M. Joshi | 2014-04-22 |
| 8691747 | Method of treatment based on ATAD2 inhibitors | Laurens Kruidenier, David Francis Tough, David Matthew Wilson | 2014-04-08 |
| 8349845 | Thiazolopyrimidines for use in therapy | Fei-Yue Zhao, Alistair Dixon, Jonathan Mark Treherne, Chizuko Koseki, David Spanswick | 2013-01-08 |
| 8297605 | Multipurpose ball joint assembly and work holding devices | Tony James Berry | 2012-10-30 |
| 8104172 | Method buffer coating having a physical mixture of high toughness polymer and a low shrinkage polymer | Michael Goodner | 2012-01-31 |
| 8017398 | Method for assaying protein-protein interaction | Richard Axel, Walter Strapps, Gilad Barnea | 2011-09-13 |
| 7982311 | Solder limiting layer for integrated circuit die copper bumps | — | 2011-07-19 |
| 7964965 | Forming thick metal interconnect structures for integrated circuits | — | 2011-06-21 |
| 7833899 | Multi-layer thick metallization structure for a microelectronic device, intergrated circuit containing same, and method of manufacturing an integrated circuit containing same | — | 2010-11-16 |
| 7785809 | Nucleic acids and proteins of insect Or83b odorant receptor genes and uses thereof | Thuy-Ai T. Nguyen, Brian Kloss | 2010-08-31 |
| 7759321 | Compounds for the treatment of pain | Peter Richardson, Lisa Lione | 2010-07-20 |
| 7732936 | Buffer coating having a physical mixture of high toughness polymer and a low shrinkage polymer | Michael Goodner | 2010-06-08 |
| 7601829 | Nucleic acids and proteins of insect Or83b odorant receptor genes and uses thereof | Thuy-Ai T. Nguyen, Brian Kloss | 2009-10-13 |
| 7585615 | Composite photoresist for modifying die-side bumps | Kurt Schultz, Michael Goodner, Shane Nolen | 2009-09-08 |
| 7550574 | Nucleic acids and proteins of insect Or83b odorant receptor genes and uses thereof | Thuy-Ai T. Nguyen, Brian Kloss | 2009-06-23 |