Issued Patents All Time
Showing 26–39 of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9502281 | AVD hardmask for damascene patterning | Kevin J. Fischer, Michael A. Childs | 2016-11-22 |
| 9343524 | Etchstop layers and capacitors | — | 2016-05-17 |
| 9054068 | Etchstop layers and capacitors | — | 2015-06-09 |
| 8933564 | Landing structure for through-silicon via | Christopher M. Pelto, Kevin J. Lee, Gerald S. Leatherman | 2015-01-13 |
| 8143159 | Fabrication of interconnects in a low-k interlayer dielectrics | Sean King | 2012-03-27 |
| 8058177 | Winged vias to increase overlay margin | Martin Weiss, Bob Bigwood, Shannon Daviess | 2011-11-15 |
| 7812455 | Interconnect in low-k interlayer dielectrics | Sean King | 2010-10-12 |
| 7008872 | Use of conductive electrolessly deposited etch stop layers, liner layers and via plugs in interconnect structures | Valery M. Dubin, Chin-Chang Cheng, Makarem A. Hussein, Phi L. Nguyen | 2006-03-07 |
| 6958547 | Interconnect structures containing conductive electrolessly deposited etch stop layers, liner layers, and via plugs | Valery M. Dubin, Chin-Chang Cheng, Makarem A. Hussein, Phi L. Nguyen | 2005-10-25 |
| 6774037 | Method integrating polymeric interlayer dielectric in integrated circuits | Makarem A. Hussein, Robert Turklot, Sam Sivakumar | 2004-08-10 |
| 6365514 | Two chamber metal reflow process | Jick Yu | 2002-04-02 |
| 6048445 | Method of forming a metal line utilizing electroplating | — | 2000-04-11 |
| 5851319 | Method and apparatus for selectively annealing heterostructures using microwaves | Harry A. Atwater, Martin B. Barmatz | 1998-12-22 |
| 5707466 | Method and apparatus for selectively annealing heterostructures using microwave | Harry A. Atwater, Martin B. Barmatz | 1998-01-13 |