Issued Patents All Time
Showing 51–75 of 89 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11087832 | Three-dimensional nanoribbon-based static random-access memory | Wilfred Gomes, Kinyip Phoa, Tahir Ghani | 2021-08-10 |
| 11062995 | Interconnect fabricated with flowable copper | Carl Naylor | 2021-07-13 |
| 11056492 | Dense memory arrays utilizing access transistors with back-side contacts | Wilfred Gomes, Elliot N. Tan, Szuya S. Liao, Tahir Ghani, Swaminathan Sivakumar +1 more | 2021-07-06 |
| 11056356 | Fluid viscosity control during wafer bonding | Brennen Mueller, Daniel Pantuso, Chytra Pawashe, Myra McDonnell | 2021-07-06 |
| 10892337 | Backside source/drain replacement for semiconductor devices with metallization on both sides | Glenn A. Glass, Karthik Jambunathan, Anand S. Murthy, Chandra S. Mohapatra, Patrick Morrow | 2021-01-12 |
| 10886217 | Integrated circuit device with back-side interconnection to deep source/drain semiconductor | Patrick Morrow, Mark Bohr, Tahir Ghani, Rishabh Mehandru | 2021-01-05 |
| 10797139 | Methods of forming backside self-aligned vias and structures formed thereby | Patrick Morrow, Kimin Jun, Il-Seok Son, Paul B. Fischer | 2020-10-06 |
| 10734412 | Backside contact resistance reduction for semiconductor devices with metallization on both sides | Glenn A. Glass, Anand S. Murthy, Karthik Jambunathan, Chandra S. Mohapatra, Patrick Morrow | 2020-08-04 |
| 10720345 | Wafer to wafer bonding with low wafer distortion | Myra McDonnell, Brennen Mueller, Chytra Pawashe, Daniel Pantuso, Paul B. Fischer +2 more | 2020-07-21 |
| 10707186 | Compliant layer for wafer to wafer bonding | Jasmeet S. Chawla, Stefan Meister, Myra McDonnell, Chytra Pawashe, Daniel Pantuso | 2020-07-07 |
| 10685949 | Flexible electronic system with wire bonds | Aleksandar Aleksov, Johanna M. Swan, Rajendra C. Dias | 2020-06-16 |
| 10553532 | Structure and method to self align via to top and bottom of tight pitch metal interconnect layers | Richard E. Schenker, Manish Chandhok, Robert L. Bristol, Kevin Lin | 2020-02-04 |
| 10529660 | Pore-filled dielectric materials for semiconductor structure fabrication and their methods of fabrication | Jessica M. Torres, Jeffery D. Bielefeld, Christopher J. Jezewski, Gopinath Bhimarasetti | 2020-01-07 |
| 10497613 | Microelectronic conductive routes and methods of making the same | Jasmeet S. Chawla, Rami Hourani, Florian Gstrein, Scott B. Clendenning, Jeanette M. Roberts | 2019-12-03 |
| 10468357 | Stretchable electronics fabrication method with strain redistribution layer | Rajendra C. Dias, Tatyana N. Andryushchenko, Aleksandar Aleksov, David Staines | 2019-11-05 |
| 10367070 | Methods of forming backside self-aligned vias and structures formed thereby | Patrick Morrow, Kimin Jun, Il-Seok Son, Paul B. Fischer | 2019-07-30 |
| 10204855 | Bendable and stretchable electronic devices and methods | Alejandro X. Levander, Tatyana N. Andryushchenko, David Staines, Aleksandar Aleksov, Dilan Seneviratne +3 more | 2019-02-12 |
| 10054737 | Optical I/O system using planar light-wave integrated circuit | Henning Braunisch, Shawna M. Liff, Peter L. D. Chang, Bruce A. Block, Johanna M. Swan | 2018-08-21 |
| 9691716 | Techniques for enhancing fracture resistance of interconnects | Christopher J. Jezewski, Daniel Pantuso, Siddharth B. Bhingarde, Michael P. O'Day | 2017-06-27 |
| 9591758 | Flexible electronic system with wire bonds | Aleksandar Aleksov, Johanna M. Swan, Rajendra C. Dias | 2017-03-07 |
| 9507086 | Optical I/O system using planar light-wave integrated circuit | Henning Braunisch, Shawna M. Liff, Peter L. D. Chang, Bruce A. Block, Johanna M. Swan | 2016-11-29 |
| 9443922 | Metal-insulator-metal capacitor formation techniques | Robert L. Bristol, Michael C. Mayberry | 2016-09-13 |
| 9391019 | Scalable interconnect structures with selective via posts | Tatyana N. Andryushchenko, Ramanan V. Chebiam, Hui Jae Yoo | 2016-07-12 |
| 9343411 | Techniques for enhancing fracture resistance of interconnects | Christopher J. Jezewski, Daniel Pantuso, Siddharth B. Bhingarde, Michael P. O'Day | 2016-05-17 |
| 9182544 | Fabrication of planar light-wave circuits (PLCS) for optical I/O | Miriam Reshotko, Ibrahim Ban, Bruce A. Block, Peter L. D. Chang | 2015-11-10 |