| 12107170 |
Transistor channel passivation with 2D crystalline material |
Carl Naylor, Abhishek A. Sharma, Christopher J. Jezewski, Urusa Alaan, Justin R. Weber |
2024-10-01 |
$20,560,000 |
| 12100705 |
Deep trench via for three-dimensional integrated circuit |
Yih Wang, Rishabh Mehandru, Tahir Ghani, Mark Bohr, Marni Nabors |
2024-09-24 |
$33,787,000 |
| 12058849 |
Three-dimensional nanoribbon-based dynamic random-access memory |
Wilfred Gomes, Kinyip Phoa, Tahir Ghani, Uygar E. Avci, Rajesh Kumar |
2024-08-06 |
$17,070,000 |
| 11996362 |
Integrated circuit device with crenellated metal trace layout |
Patrick Morrow, Mark Bohr, Tahir Ghani, Rishabh Mehandru, Ranjith Kumar |
2024-05-28 |
$30,739,000 |
| 11985909 |
Fabrication of stackable embedded eDRAM using a binary alloy based on antimony |
Elijah V. Karpov |
2024-05-14 |
$33,809,000 |
| 11948874 |
Vertically spaced intra-level interconnect line metallization for integrated circuit devices |
Kevin Lin, Sukru YEMENICIOGLU, Patrick Morrow, Richard E. Schenker |
2024-04-02 |
$34,819,000 |
| 11901347 |
Microelectronic package with three-dimensional (3D) monolithic memory die |
Wilfred Gomes, Doug B. Ingerly, Tahir Ghani |
2024-02-13 |
$18,546,000 |
| 11881452 |
Device layer interconnects |
Mark Bohr, Marni Nabors |
2024-01-23 |
$52,361,000 |
| 11830788 |
Integrated circuits and methods for forming integrated circuits |
Carl Naylor, Ashish Agrawal, Urusa Alaan, Christopher J. Jezewski, Kevin Lin +1 more |
2023-11-28 |
$31,872,000 |
| 11817442 |
Hybrid manufacturing for integrated circuit devices and assemblies |
Wilfred Gomes, Abhishek A. Sharma, Doug B. Ingerly |
2023-11-14 |
$31,444,000 |
| 11799037 |
Gate-all-around integrated circuit structures having asymmetric source and drain contact structures |
Biswajeet Guha, Tahir Ghani |
2023-10-24 |
$20,059,000 |
| 11756886 |
Hybrid manufacturing of microeletronic assemblies with first and second integrated circuit structures |
Wilfred Gomes, Abhishek A. Sharma, Doug B. Ingerly |
2023-09-12 |
$19,004,000 |
| 11721554 |
Stress compensation for wafer to wafer bonding |
Anant H. JAHAGIRDAR, Chytra Pawashe, Aaron D. Lilak, Myra McDonnell, Brennen Mueller |
2023-08-08 |
$22,376,000 |
| 11690211 |
Thin film transistor based memory cells on both sides of a layer of logic devices |
Wilfred Gomes, Conor P. Puls, Kevin J. Fischer, Bernhard Sell, Abhishek A. Sharma +1 more |
2023-06-27 |
$18,721,000 |
| 11621354 |
Integrated circuit structures having partitioned source or drain contact structures |
Stephanie A. Bojarski, Babita Dhayal, Biswajeet Guha, Tahir Ghani |
2023-04-04 |
$21,090,000 |
| 11616015 |
Integrated circuit device with back-side interconnection to deep source/drain semiconductor |
Patrick Morrow, Mark Bohr, Tahir Ghani, Rishabh Mehandru |
2023-03-28 |
$20,940,000 |
| 11532558 |
Metallization barrier structures for bonded integrated circuit interfaces |
Carl Naylor, Richard Vreeland, Ramanan V. Chebiam, William Brezinski, Brennen Mueller +1 more |
2022-12-20 |
$12,719,000 |
| 11444166 |
Backside source/drain replacement for semiconductor devices with metallization on both sides |
Glenn A. Glass, Karthik Jambunathan, Anand S. Murthy, Chandra S. Mohapatra, Patrick Morrow |
2022-09-13 |
$14,653,000 |
| 11410928 |
Device layer interconnects |
Mark Bohr, Marni Nabors |
2022-08-09 |
$13,688,000 |
| 11373999 |
Deep trench via for three-dimensional integrated circuit |
Yih Wang, Rishabh Mehandru, Tahir Ghani, Mark Bohr, Marni Nabors |
2022-06-28 |
$15,065,000 |
| 11367796 |
Gate-all-around integrated circuit structures having asymmetric source and drain contact structures |
Biswajeet Guha, Tahir Ghani |
2022-06-21 |
$17,814,000 |
| 11335686 |
Transistors with back-side contacts to create three dimensional memory and logic |
Wilfred Gomes, Abhishek A. Sharma, Tahir Ghani, Doug B. Ingerly, Rajesh Kumar |
2022-05-17 |
$14,251,000 |
| 11329162 |
Integrated circuit structures having differentiated neighboring partitioned source or drain contact structures |
Stephanie A. Bojarski, Myra McDonnell, Tahir Ghani |
2022-05-10 |
$19,182,000 |
| 11328951 |
Transistor cells including a deep via lined wit h a dielectric material |
Patrick Morrow, Rishabh Mehandru |
2022-05-10 |
$19,182,000 |
| 11276644 |
Integrated circuits and methods for forming thin film crystal layers |
Carl Naylor, Ashish Agrawal, Kevin Lin, Abhishek A. Sharma, Christopher J. Jezewski +1 more |
2022-03-15 |
$18,336,000 |
