Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12402349 | Gate-all-around integrated circuit structures having devices with channel-to-substrate electrical contact | Biswajeet Guha, William Hsu, Chung-Hsun Lin, Oleg Golonzka, Ayan Kar +5 more | 2025-08-26 |
| 12288789 | Gate-all-around integrated circuit structures having devices with source/drain-to-substrate electrical contact | Biswajeet Guha, William Hsu, Chung-Hsun Lin, Oleg Golonzka, Tahir Ghani +5 more | 2025-04-29 |
| 12272737 | Gate-all-around integrated circuit structures having adjacent structures for sub-fin electrical contact | Biswajeet Guha, William Hsu, Chung-Hsun Lin, Oleg Golonzka, Tahir Ghani | 2025-04-08 |
| 12114479 | Three-dimensional memory arrays with layer selector transistors | Wilfred Gomes, Mauro J. Kobrinsky, Abhishek A. Sharma, Rajesh Kumar, Elliot N. Tan +2 more | 2024-10-08 |
| 12058849 | Three-dimensional nanoribbon-based dynamic random-access memory | Wilfred Gomes, Mauro J. Kobrinsky, Tahir Ghani, Uygar E. Avci, Rajesh Kumar | 2024-08-06 |
| 11973105 | Embedded precision resistor for non-planar semiconductor device architectures | Chieh-Jen Ku, Bernhard Sell, Leif Paulson, Shi-You Liu | 2024-04-30 |
| 11908856 | Gate-all-around integrated circuit structures having devices with source/drain-to-substrate electrical contact | Biswajeet Guha, William Hsu, Chung-Hsun Lin, Oleg Golonzka, Tahir Ghani +5 more | 2024-02-20 |
| 11837641 | Gate-all-around integrated circuit structures having adjacent deep via substrate contacts for sub-fin electrical contact | Biswajeet Guha, William Hsu, Chung-Hsun Lin, Oleg Golonzka, Tahir Ghani +5 more | 2023-12-05 |
| 11830818 | Semiconductor device having metal interconnects with different thicknesses | Jui-Yen Lin, Nidhi Nidhi, Chia-Hong Jan | 2023-11-28 |
| 11824116 | Gate-all-around integrated circuit structures having devices with channel-to-substrate electrical contact | Biswajeet Guha, William Hsu, Chung-Hsun Lin, Oleg Golonzka, Ayan Kar +5 more | 2023-11-21 |
| 11799009 | Gate-all-around integrated circuit structures having adjacent structures for sub-fin electrical contact | Biswajeet Guha, William Hsu, Chung-Hsun Lin, Oleg Golonzka, Tahir Ghani | 2023-10-24 |
| 11737362 | Harvesting energy in an integrated circuit using the seebeck effect | Jui-Yen Lin, Nidhi Nidhi, Chia-Hong Jan | 2023-08-22 |
| 11621334 | Non-planar integrated circuit structures having asymmetric source and drain trench contact spacing | Said Rami, Hyung-Jin Lee, Surej Ravikumar | 2023-04-04 |
| 11393934 | FinFET based capacitors and resistors and related apparatuses, systems, and methods | Ayan Kar, Justin S. Sandford, Junjun Wan, Akm A. Ahsan, Leif Paulson +1 more | 2022-07-19 |
| 11264329 | Semiconductor device having metal interconnects with different thicknesses | Jui-Yen Lin, Nidhi Nidhi, Chia-Hong Jan | 2022-03-01 |
| 11257822 | Three-dimensional nanoribbon-based dynamic random-access memory | Wilfred Gomes, Mauro J. Kobrinsky, Tahir Ghani, Uygar E. Avci, Rajesh Kumar | 2022-02-22 |
| 11139300 | Three-dimensional memory arrays with layer selector transistors | Wilfred Gomes, Mauro J. Kobrinsky, Abhishek A. Sharma, Rajesh Kumar, Elliot N. Tan +2 more | 2021-10-05 |
| 11087832 | Three-dimensional nanoribbon-based static random-access memory | Wilfred Gomes, Mauro J. Kobrinsky, Tahir Ghani | 2021-08-10 |
| 11018264 | Three-dimensional nanoribbon-based logic | Wilfred Gomes, Tahir Ghani, Rajesh Kumar | 2021-05-25 |
| 10903372 | Metal-oxide-polysilicon tunable resistor for flexible circuit design and method of fabricating same | Jui-Yen Lin, Nidhi Nidhi, Chia-Hong Jan | 2021-01-26 |
| 10505034 | Vertical transistor using a through silicon via gate | Xiaodong Yang, Jui-Yen Lin, Nidhi Nidhi, Yi-Wei Chen, Kun-Huan Shih +2 more | 2019-12-10 |
| 10312367 | Monolithic integration of high voltage transistors and low voltage non-planar transistors | Nidhi Nidhi, Chia-Hong Jan, Ting Chang | 2019-06-04 |
| 10229866 | On-chip through-body-via capacitors and techniques for forming same | Yi-Wei Chen, Nidhi Nidhi, Jui-Yen Lin, Kun-Huan Shih, Xiaodong Yang +2 more | 2019-03-12 |
| 10158034 | Through silicon via based photovoltaic cell | Nidhi Nidhi, Chia-Hong Jan, Walid M. Hafez, Yi-Wei Chen | 2018-12-18 |