Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Printed circuit board with a recess to accommodate discrete components in a package

Printed circuit board with a recess to accommodate discrete components in a package

US Patent 10187996 · Granted Jan 22, 2019

Estimated economic value: $27,645,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Ultra-thin, hyper-density semiconductor packages2025
Ultra-thin, hyper-density semiconductor packages2025
Pitch translation architecture for semiconductor package including embedded inte2025
Pitch translation architecture for semiconductor package including embedded inte2025
Interconnect architecture with silicon interposer and EMIB2025
IC die and heat spreaders with solderable thermal interface structures for multi2025
Mold shelf package design and process flow for advanced package architectures2025
Microelectronic component having molded regions with through-mold vias2024
No mold shelf package design and process flow for advanced package architectures2024
Glass core package substrates2024
Pitch translation architecture for semiconductor package including embedded inte2024
Pitch translation architecture for semiconductor package including embedded inte2024