Issued Patents All Time
Showing 26–47 of 47 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9832876 | CPU package substrates with removable memory mechanical interfaces | Mani N. Prakash, Thomas T. Holden, Jeffory L. Smalley, Bassam N. Coury, Dimitrios Ziakas +11 more | 2017-11-28 |
| 9674954 | Chip package connector assembly | Rajasekaran Swaminathan, Donald T. Tran, Brent Stone | 2017-06-06 |
| 9640887 | Low profile zero/low insertion force package top side flex cable connector architecture | Sanka Ganesan | 2017-05-02 |
| 9603247 | Electronic package with narrow-factor via including finish layer | Rajasekaran Swaminathan, Sairam Agraharam, Amruthavalli Pallavi Alur, Wei-Lun Kane Jen | 2017-03-21 |
| 9461014 | Methods of forming ultra thin package structures including low temperature solder and structures formed therby | Sriram Srinivasan, Paul R. Start, Rajen S. Sidhu, Rajasekaran Swaminathan | 2016-10-04 |
| 9391013 | 3D integrated circuit package with window interposer | Debendra Mallik, Sriram Srinivasan, Mark Bohr, Andrew W. Yeoh, Sairam Agraharam | 2016-07-12 |
| 9324678 | Low profile zero/low insertion force package top side flex cable connector architecture | Sanka Ganesan | 2016-04-26 |
| 9265170 | Integrated circuit connectors | Rajasekaran Swaminathan, Sanka Ganesan, Gaurav Chawla, Joshua D. Heppner, Jeffory L. Smalley +4 more | 2016-02-16 |
| 9129958 | 3D integrated circuit package with window interposer | Debendra Mallik, Sriram Srinivasan, Mark Bohr, Andrew W. Yeoh, Sairam Agraharam | 2015-09-08 |
| 9064971 | Methods of forming ultra thin package structures including low temperature solder and structures formed therby | Sriram Srinivasan, Paul R. Start, Rajen S. Sidhu, Rajasekaran Swaminathan | 2015-06-23 |
| 8513792 | Package-on-package interconnect stiffener | Sanka Ganesan, Yosuke Kanaoka, Rajasekaran Swaminathan, Robert M. Nickerson, Leonel Arana +2 more | 2013-08-20 |
| 6979208 | Laminated socket contacts | Hong Xie, Pr Patel | 2005-12-27 |
| 6888722 | Thermal design for minimizing interface in a multi-site thermal contact condition | — | 2005-05-03 |
| 6854979 | Laminated socket contacts | Hong Xie, Pr Patel | 2005-02-15 |
| 6672880 | Laminated socket contacts | Hong Xie, Pr Patel | 2004-01-06 |
| 6575766 | Laminated socket contacts | Hong Xie, Pr Patel | 2003-06-10 |
| 6493223 | Computer utilizing refrigeration for cooling | Hong Xie, Robert L. Sankman | 2002-12-10 |
| 6189601 | Heat sink with a heat pipe for spreading of heat | Lloyd Jack Goodman, Chai-Pin Chiu, Abhay Watwe | 2001-02-20 |
| 6072322 | Thermally enhanced test socket | Martin M. Maxwell | 2000-06-06 |
| 6049217 | Thermally enhanced test contactor | Martin M. Maxwell, Navid Shahriari | 2000-04-11 |
| 6019166 | Pickup chuck with an integral heatsink | Philip Martin | 2000-02-01 |
| 5944093 | Pickup chuck with an integral heat pipe | — | 1999-08-31 |