Issued Patents All Time
Showing 26–50 of 130 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11978685 | Glass core patch with in situ fabricated fan-out layer to enable die tiling applications | Srinivas V. Pietambaram, Robert L. Sankman, Rahul N. Manepalli, Gang Duan | 2024-05-07 |
| 11978727 | Package on active silicon semiconductor packages | Wilfred Gomes, Sanka Ganesan, Doug B. Ingerly, Robert L. Sankman, Mark Bohr | 2024-05-07 |
| 11935808 | IC die and heat spreaders with solderable thermal interface structures for multi-chip assemblies including solder array thermal interconnects | Je-Young Chang, Ram Viswanath, Elah Bozorg-Grayeli, Ahmad Al Mohammad | 2024-03-19 |
| 11923267 | IC die with solderable thermal interface structures for assemblies including solder array thermal interconnects | Je-Young Chang, Ram Viswanath, Elah Bozorg-Grayeli, Ahmad Al Mohammad | 2024-03-05 |
| 11908793 | Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge | Jiun Hann Sir, Poh Boon Khoo, Eng Huat Goh, Amruthavalli Pallavi Alur | 2024-02-20 |
| 11901299 | Interconnect architecture with silicon interposer and EMIB | MD Altaf Hossain, Ankireddy Nalamalpu, Dheeraj Subbareddy, Robert Sankman, Ravindranath V. Mahajan +7 more | 2024-02-13 |
| 11824018 | Heterogeneous nested interposer package for IC chips | Ravindranath V. Mahajan, Robert L. Sankman, Shawna M. Liff, Srinivas V. Pietambaram, Bharat P. Penmecha | 2023-11-21 |
| 11804441 | Microelectronic structures including bridges | Omkar G. Karhade, Nitin A. Deshpande, Mohit Bhatia | 2023-10-31 |
| 11798887 | Inorganic-based embedded-die layers for modular semiconductive devices | Srinivas V. Pietambaram, Tarek A. Ibrahim, Kristof Darmawikarta, Rahul N. Manepalli, Robert L. Sankman | 2023-10-24 |
| 11798865 | Nested architectures for enhanced heterogeneous integration | Ravindranath V. Mahajan, Sujit Sharan, Digvijay A. Raorane | 2023-10-24 |
| 11764080 | Low cost package warpage solution | Omkar G. Karhade, Nitin A. Deshpande, Bassam M. Ziadeh, Yoshihiro Tomita | 2023-09-19 |
| 11756889 | Ultrathin bridge and multi-die ultrafine pitch patch architecture and method of making | Sanka Ganesan, Kevin Thomas McCarthy, Leigh M. TRIBOLET, Ravindranath V. Mahajan, Robert L. Sankman | 2023-09-12 |
| 11749577 | IC package including multi-chip unit with bonded integrated heat spreader | Ravindranath V. Mahajan, Digvijay A. Raorane | 2023-09-05 |
| 11742261 | Nested architectures for enhanced heterogeneous integration | Ravindranath V. Mahajan, Sujit Sharan, Digvijay A. Raorane | 2023-08-29 |
| 11735552 | Microelectronic package with solder array thermal interface material (SA-TIM) | Sergio Antonio Chan Arguedas, Jimin Yao, Chandra Mohan Jha | 2023-08-22 |
| 11735533 | Heterogeneous nested interposer package for IC chips | Ravindranath V. Mahajan, Robert L. Sankman, Shawna M. Liff, Srinivas V. Pietambaram, Bharat P. Penmecha | 2023-08-22 |
| 11705377 | Stacked die cavity package | Mitul Modi, Robert L. Sankman, Ravindranath V. Mahajan, Amruthavalli Pallavi Alur, Yikang Deng +1 more | 2023-07-18 |
| 11694959 | Multi-die ultrafine pitch patch architecture and method of making | Sanka Ganesan, Kevin Thomas McCarthy, Leigh M. TRIBOLET, Ravindranath V. Mahajan, Robert L. Sankman | 2023-07-04 |
| 11658111 | Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge | Jiun Hann Sir, Poh Boon Khoo, Eng Huat Goh, Amruthavalli Pallavi Alur | 2023-05-23 |
| 11581235 | IC package including multi-chip unit with bonded integrated heat spreader | Ravindranath V. Mahajan, Digvijay A. Raorane | 2023-02-14 |
| 11557541 | Interconnect architecture with silicon interposer and EMIB | MD Altaf Hossain, Ankireddy Nalamalpu, Dheeraj Subbareddy, Robert Sankman, Ravindranath V. Mahajan +7 more | 2023-01-17 |
| 11552035 | Electronic package with stud bump electrical connections | Zhaozhi Li, Sanka Ganesan, Gregory Perry, Kuan-Hsun Lu, Omkar G. Karhade +1 more | 2023-01-10 |
| 11545441 | Semiconductor package having wafer-level active die and external die mount | Vipul V. Mehta, Eric J. Li, Sanka Ganesan, Robert L. Sankman | 2023-01-03 |
| 11545407 | Thermal management solutions for integrated circuit packages | Kumar Abhishek Singh, Omkar G. Karhade, Nitin A. Deshpande, Mitul Modi, Edvin Cetegen +8 more | 2023-01-03 |
| 11522291 | Antenna boards and communication devices | Omkar G. Karhade, William J. Lambert, Xiaoqian Li, Nitin A. Deshpande | 2022-12-06 |