Issued Patents All Time
Showing 51–75 of 130 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515248 | Localized high density substrate routing | Robert Starkston, John S. Guzek, Chia-Pin Chiu, Deepak Kulkarni, Ravi Mahajan | 2022-11-29 |
| 11430724 | Ultra-thin, hyper-density semiconductor packages | Robert L. Sankman, Robert M. Nickerson, Mitul Modi, Sanka Ganesan, Rajasekaran Swaminathan +4 more | 2022-08-30 |
| 11417630 | Semiconductor package having passive support wafer | Digvijay A. Raorane, Ravindranath V. Mahajan, Mitul Modi | 2022-08-16 |
| 11387175 | Interposer package-on-package (PoP) with solder array thermal contacts | Sanka Ganesan, Pilin Liu, Shawna M. Liff, Sri Chaitra Jyotsna Chavali, Sandeep Gaan +2 more | 2022-07-12 |
| 11328937 | Low cost package warpage solution | Omkar G. Karhade, Nitin A. Deshpande, Bassam M. Ziadeh, Yoshihiro Tomita | 2022-05-10 |
| 11328968 | Stacked die cavity package | Mitul Modi, Robert L. Sankman, Ravindranath V. Mahajan, Amruthavalli Pallavi Alur, Yikang Deng +1 more | 2022-05-10 |
| 11164818 | Inorganic-based embedded-die layers for modular semiconductive devices | Srinivas V. Pietambaram, Tarek A. Ibrahim, Kristof Darmawikarta, Rahul N. Manepalli, Robert L. Sankman | 2021-11-02 |
| 11127706 | Electronic package with stud bump electrical connections | Zhaozhi Li, Sanka Ganesan, Gregory Perry, Kuan-Hsun Lu, Omkar G. Karhade +1 more | 2021-09-21 |
| 11011448 | IC package including multi-chip unit with bonded integrated heat spreader | Ravindranath V. Mahajan, Digvijay A. Raorane | 2021-05-18 |
| 10998262 | Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge | Jiun Hann Sir, Poh Boon Khoo, Eng Huat Goh, Amruthavalli Pallavi Alur | 2021-05-04 |
| 10910317 | Semiconductor package having wafer-level active die and external die mount | Vipul V. Mehta, Eric J. Li, Sanka Ganesan, Robert L. Sankman | 2021-02-02 |
| 10847467 | Power-delivery methods for embedded multi-die interconnect bridges and methods of assembling same | Andrew Collins, Mathew J. Manusharow, Jianyong Xie | 2020-11-24 |
| 10796988 | Localized high density substrate routing | Robert Starkston, John S. Guzek, Chia-Pin Chiu, Deepak Kulkarni, Ravi Mahajan | 2020-10-06 |
| 10741419 | Low cost package warpage solution | Omkar G. Karhade, Nitin A. Deshpande, Bassam M. Ziadeh, Yoshihiro Tomita | 2020-08-11 |
| 10658765 | Edge-firing antenna walls built into substrate | Sri Chaitra Jyotsna Chavali, Sanka Ganesan, William J. Lambert, Zhichao Zhang | 2020-05-19 |
| 10636716 | Through-mold structures | Sasha N. Oster, Srikant Nekkanty, Joshua D. Heppner, Adel A. Elsherbini, Yoshihiro Tomita +2 more | 2020-04-28 |
| 10522455 | Integrated circuit package substrate | Mathew J. Manusharow, Dustin P. Wood | 2019-12-31 |
| 10490503 | Power-delivery methods for embedded multi-die interconnect bridges and methods of assembling same | Andrew Collins, Mathew J. Manusharow, Jianyong Xie | 2019-11-26 |
| 10403512 | Low cost package warpage solution | Omkar G. Karhade, Nitin A. Deshpande, Bassam M. Ziadeh, Yoshihiro Tomita | 2019-09-03 |
| 10366951 | Localized high density substrate routing | Robert Starkston, John S. Guzek, Chia-Pin Chiu, Deepak Kulkarni, Ravindranath V. Mahajan | 2019-07-30 |
| 10242942 | Integrated circuit package substrate | Mathew J. Manusharow, Dustin P. Wood | 2019-03-26 |
| 10193493 | Multi-surface solar cell packaging for self-powered electronic devices | Joshua D. Heppner | 2019-01-29 |
| 10090277 | 3D integrated circuit package with through-mold first level interconnects | Robert L. Sankman | 2018-10-02 |
| 10074357 | Integrated acoustic phase array | Sasikanth Manipatruni, Kelin J. Kuhn, John C. Johnson | 2018-09-11 |
| 9899238 | Low cost package warpage solution | Omkar G. Karhade, Nitin A. Deshpande, Bassam M. Ziadeh, Yoshihiro Tomita | 2018-02-20 |