Issued Patents All Time
Showing 101–125 of 130 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7794236 | Land grid array (LGA) socket for various package sizes | Brent Stone | 2010-09-14 |
| 7656035 | C4 joint reliability | Sairam Agraharam, Carlton Hanna, Dongming He, Vasudeva Atluri, Matthew Escobido +1 more | 2010-02-02 |
| 7517787 | C4 joint reliability | Sairam Agraharam, Carlton Hanna, Dongming He, Vasudeva Atluri, Matthew Escobido +1 more | 2009-04-14 |
| 7456047 | Thermally enhanced electronic flip-chip packaging with external-connector-side die and method | Robert L. Sankman | 2008-11-25 |
| 7345361 | Stackable integrated circuit packaging | Kinya Ichikawa, Terry Sterrett, Johanna M. Swan | 2008-03-18 |
| 7321172 | Selective plating of package terminals | Dustin P. Wood | 2008-01-22 |
| 7268425 | Thermally enhanced electronic flip-chip packaging with external-connector-side die and method | Robert L. Sankman | 2007-09-11 |
| 7199304 | Configurable microelectronic package using electrically conductive material | Jeff Wienrich, Joni G. Hansen | 2007-04-03 |
| 7186645 | Selective plating of package terminals | Dustin P. Wood | 2007-03-06 |
| 7187068 | Methods and apparatuses for providing stacked-die devices | Daewoong Suh | 2007-03-06 |
| 6992891 | Metal ball attachment of heat dissipation devices | Christopher L. Rumer, Jeffrey Winton, Michele Berry | 2006-01-31 |
| 6975025 | Semiconductor chip package and method of manufacturing same | Vassoudevane Lebonheur, Eduardo Bolanos | 2005-12-13 |
| 6821823 | Molded substrate stiffener with embedded capacitors | Hong Xie | 2004-11-23 |
| 6710444 | Molded substrate stiffener with embedded capacitors | Hong Xie | 2004-03-23 |
| 6545346 | Integrated circuit package with a capacitor | David G. Figueroa, Jorge P. Rodriguez | 2003-04-08 |
| 6016852 | Leaded grid array IC package having coplanar bent leads for surface mount technology | Rudra Kar | 2000-01-25 |
| 5844316 | Fixture for handling and attaching conductive spheres to a substrate | Joni G. Hansen, Ashok K. Seth, Neil R. Sugai | 1998-12-01 |
| 5777265 | Multilayer molded plastic package design | Bidyut K. Bhattacharyya, Ron Vitt, David B. Kline | 1998-07-07 |
| 5685477 | Method for attaching and handling conductive spheres to a substrate | Joni G. Hansen, Ashok K. Seth, Neil R. Sugai | 1997-11-11 |
| 5557502 | Structure of a thermally and electrically enhanced plastic ball grid array package | Koushik Banerjee, Ashok K. Seth | 1996-09-17 |
| 5556807 | Advance multilayer molded plastic package using mesic technology | Bidyut K. Bhattacharyya, Syunsuke Ban, Takatoshi Takikawa, Shosaku Yamanaka | 1996-09-17 |
| 5519580 | Method of controlling solder ball size of BGA IC components | Siva Natarajan | 1996-05-21 |
| 5488257 | Multilayer molded plastic package using mesic technology | Bidyut K. Bhattacharyya | 1996-01-30 |
| 5444602 | An electronic package that has a die coupled to a lead frame by a dielectric tape and a heat sink that providees both an electrical and a thermal path between the die and teh lead frame | Koushik Banerjee, Siva Natarajan, Praveen Jain | 1995-08-22 |
| 5420461 | Integrated circuit having a two-dimensional lead grid array | Bidyut K. Bhattacharyya | 1995-05-30 |