Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6016852 | Leaded grid array IC package having coplanar bent leads for surface mount technology | Debendra Mallik | 2000-01-25 |
| 5665296 | Molding technique for molding plastic packages | Praveen Jain | 1997-09-09 |