SY

Shosaku Yamanaka

Sumitomo Electric Industries: 22 patents #886 of 21,551Top 5%
IN Intel: 1 patents #18,218 of 30,777Top 60%
📍 Kasai, JP: #325 of 5,842 inventorsTop 6%
Overall (All Time): #186,579 of 4,157,543Top 5%
23
Patents All Time

Issued Patents All Time

Showing 1–23 of 23 patents

Patent #TitleCo-InventorsDate
6713216 Thin alkali metal film member and method of producing the same Hirokazu Kugai, Nobuhiro Ota 2004-03-30
6699619 Negative electrode of a lithium secondary battery with a two-layered inorganic solid electrolytic material Hirokazu Kugai, Nobuhiro Ota 2004-03-02
6656233 Method of producing negative electrode for lithium secondary cell Hirokazu Kugai, Nobuhiro Ota 2003-12-02
6365300 Lithium secondary battery Nobuhiro Ota 2002-04-02
6103319 Battery electrode substrate and process for producing the same Keizo Harada, Kenichi Watanabe, Kiyoshi Hayashi, Nobuyasu Morishita, Hiroki Takeshima +2 more 2000-08-15
6071650 Battery electrode substrate and process for producing the same Keizo Harada, Kenichi Watanabe 2000-06-06
6020089 Electrode plate for battery Keizo Harada, Masayuki Ishii, Kenichi Watanabe 2000-02-01
5968685 Battery electrode substrate and process for producing the same Keizo Harada, Kenichi Watanabe, Kiyoshi Hayashi, Nobuyasu Morishita, Hiroki Takeshima +2 more 1999-10-19
5965298 Electrode plate for battery and process for producing the same Keizo Harada, Masayuki Ishii, Kenichi Watanabe 1999-10-12
5888658 Battery electrode substrate and process for producing the same Keizo Harada, Kenichi Watanabe, Kiyoshi Hayashi, Nobuyasu Morishita, Hiroki Takeshima +2 more 1999-03-30
5851599 Battery electrode substrate and process for producing the same Keizo Harada, Kenichi Watanabe, Kiyoshi Hayashi, Nobuyasu Morishita, Hiroki Takeshima +2 more 1998-12-22
5733684 Electrode substrate for battery and process for preparing the same Keizo Harada, Kenichi Watanabe 1998-03-31
5672411 Insulating boards and method of manufacturing the same Keizo Harada, Kenichi Watanabe 1997-09-30
5643834 Process for manufacturing a semiconductor substrate comprising laminated copper, silicon oxide and silicon nitride layers Keizo Harada, Takao Maeda, Takatoshi Takikawa, Shunsuke Ban 1997-07-01
5640669 Process for preparing metallic porous body, electrode substrate for battery and process for preparing the same Keizo Harada, Masayuki Ishii, Kenichi Watanabe 1997-06-17
5597665 Porous metal body, process for producing the same and battery plate formed therefrom Keizo Harada, Masayuki Ishii 1997-01-28
5556807 Advance multilayer molded plastic package using mesic technology Bidyut K. Bhattacharyya, Debendra Mallik, Syunsuke Ban, Takatoshi Takikawa 1996-09-17
5455453 Plastic package type semiconductor device having a rolled metal substrate Keizo Harada, Takao Maeda, Takatoshi Takikawa, Shunsuke Ban 1995-10-03
5369220 Wiring board having laminated wiring patterns Keizo Harada, Takatoshi Takikawa, Takao Maeda, Shunsuke Ban 1994-11-29
5356661 Heat transfer insulated parts and manufacturing method thereof Akira Doi, Hiromu Kawai 1994-10-18
5353499 Method of manufacturing a multilayered wiring board Hisao Hattori, Tomohiko Ihara, Hiroshi Yoshino 1994-10-11
5348792 Multilayered wiring board with wiring configurations to reduce crosstalk Hisao Hattori, Tomohiko Ihara, Hiroshi Yoshino 1994-09-20
5134459 Lead frame for semiconductor device Takao Maeda, Tomohiko Ihara, Masaharu Yasuhara 1992-07-28