Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5159432 | Semiconductor device package having improved sealing at the aluminum nitride substrate/low melting point glass interface | Soichiro Ohkubo, Akira Ohtsuka | 1992-10-27 |
| 5134459 | Lead frame for semiconductor device | Takao Maeda, Tomohiko Ihara, Shosaku Yamanaka | 1992-07-28 |