Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5556807 | Advance multilayer molded plastic package using mesic technology | Bidyut K. Bhattacharyya, Debendra Mallik, Takatoshi Takikawa, Shosaku Yamanaka | 1996-09-17 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5556807 | Advance multilayer molded plastic package using mesic technology | Bidyut K. Bhattacharyya, Debendra Mallik, Takatoshi Takikawa, Shosaku Yamanaka | 1996-09-17 |