Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6974558 | Susbstrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the same | Shinichi Yamagata, Yugaku Abe, Makoto Imamura, Akira Fukui, Yoshishige Takano +1 more | 2005-12-13 |
| 6962673 | Heat-resistant, creep-resistant aluminum alloy and billet thereof as well as methods of preparing the same | Hisao Hattori, Terukazu Tokuoka | 2005-11-08 |
| 6534190 | Substrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the same | Shinichi Yamagata, Yugaku Abe, Makoto Imamura, Akira Fukui, Yoshishige Takano +1 more | 2003-03-18 |
| 6388273 | Substrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the same | Shinichi Yamagata, Yugaku Abe, Makoto Imamura, Akira Fukui, Yoshishige Takano +1 more | 2002-05-14 |
| 6380832 | Electromagnetic actuator | Hitoshi Oyama, Takao Nishioka, Kenji Matsunuma | 2002-04-30 |
| 6371063 | Valve-open-close mechanism | Hitoshi Oyama, Takao Nishioka, Kenji Matsunuma, Toshihiko Kaji, Nozomu Kawabe +1 more | 2002-04-16 |
| 6367439 | Combination body of shim and cam | Takao Nishioka | 2002-04-09 |
| 6183874 | Substrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the same | Shinichi Yamagata, Yugaku Abe, Makoto Imamura, Akira Fukui, Yoshishige Takano +1 more | 2001-02-06 |
| 5643834 | Process for manufacturing a semiconductor substrate comprising laminated copper, silicon oxide and silicon nitride layers | Keizo Harada, Takao Maeda, Shunsuke Ban, Shosaku Yamanaka | 1997-07-01 |
| 5556807 | Advance multilayer molded plastic package using mesic technology | Bidyut K. Bhattacharyya, Debendra Mallik, Syunsuke Ban, Shosaku Yamanaka | 1996-09-17 |
| 5455453 | Plastic package type semiconductor device having a rolled metal substrate | Keizo Harada, Takao Maeda, Shunsuke Ban, Shosaku Yamanaka | 1995-10-03 |
| 5369220 | Wiring board having laminated wiring patterns | Keizo Harada, Takao Maeda, Shunsuke Ban, Shosaku Yamanaka | 1994-11-29 |