Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9199433 | Metal laminated structure and method for producing the metal laminated structure | Koji Nitta, Masatoshi Majima, Shinji Inazawa, Hiroshi Yokoyama, Osamu Suwata +1 more | 2015-12-01 |
| 8993121 | Metal laminated structure and method for producing the same | Koji Nitta, Shinji Inazawa, Akihisa Hosoe, Masatoshi Majima, Osamu Suwata +2 more | 2015-03-31 |
| 7180178 | Semiconductor heat-dissipating substrate, and manufacturing method and package therefor | Kouichi Takashima, Shin-ichi Yamagata, Akira Sasame | 2007-02-20 |
| 6979901 | Semiconductor heat-dissipating substrate, and manufacturing method and package therefor | Kouichi Takashima, Shin-ichi Yamagata, Akira Sasame | 2005-12-27 |
| 6974558 | Susbstrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the same | Shinichi Yamagata, Makoto Imamura, Akira Fukui, Yoshishige Takano, Takatoshi Takikawa +1 more | 2005-12-13 |
| 6737168 | Composite material and semiconductor device using the same | Shinichi Yamagata, Kazuya Kamitake, Akira Fukui | 2004-05-18 |
| 6534190 | Substrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the same | Shinichi Yamagata, Makoto Imamura, Akira Fukui, Yoshishige Takano, Takatoshi Takikawa +1 more | 2003-03-18 |
| 6388273 | Substrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the same | Shinichi Yamagata, Makoto Imamura, Akira Fukui, Yoshishige Takano, Takatoshi Takikawa +1 more | 2002-05-14 |
| 6183874 | Substrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the same | Shinichi Yamagata, Makoto Imamura, Akira Fukui, Yoshishige Takano, Takatoshi Takikawa +1 more | 2001-02-06 |
| 5605558 | Nitrogenous aluminum-silicon powder metallurgical alloy | Shin-ichi Yamagata, Yoshishige Takano, Tetsuya Hayashi | 1997-02-25 |
| 5448107 | Radiating fin having an improved life and thermal conductivity | Mitsuo Osada | 1995-09-05 |
| 5275782 | Housing for semiconductor device | Mitsuo Osada, Tetsuya Hayoshi | 1994-01-04 |
| 5132779 | Housing for semiconductor device with occlusion gas removed | Mitsuo Osada, Tetsuya Hayashi | 1992-07-21 |