Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7180178 | Semiconductor heat-dissipating substrate, and manufacturing method and package therefor | Kouichi Takashima, Yugaku Abe, Akira Sasame | 2007-02-20 |
| 6979901 | Semiconductor heat-dissipating substrate, and manufacturing method and package therefor | Kouichi Takashima, Yugaku Abe, Akira Sasame | 2005-12-27 |
| 6507105 | Member for semiconductor device and method for producing the same | Osamu Suwata, Chihiro Kawai, Akira Fukui, Yoshinobu Takeda | 2003-01-14 |
| 6280496 | Silicon carbide based composite material and manufacturing method thereof | Chihiro Kawai, Akira Fukui, Yoshinobu Takeda | 2001-08-28 |
| 6123895 | Aluminum base member for semiconductor device containing a nitrogen rich surface and method for producing the same | Osamu Suwata, Chihiro Kawai, Akira Fukui, Yoshinobu Takeda | 2000-09-26 |
| 5828127 | Semiconductor substate with improved thermal conductivity | Kazuya Kamitake, Yoshishige Takano | 1998-10-27 |
| 5605558 | Nitrogenous aluminum-silicon powder metallurgical alloy | Yoshishige Takano, Tetsuya Hayashi, Yugaku Abe | 1997-02-25 |
| 5533930 | Apparatus for producing a silicon nitride sintered body | Yasushi Tsuzuki, Akira Yamakawa | 1996-07-09 |