Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8097550 | Spinel sintered body, light transmitting window and light transmitting lens | Ken-ichiro Shibata, Akihito Fujii, Shigeru Nakayama | 2012-01-17 |
| 7741238 | Spinel sintered body, light transmitting window and light transmitting lens | Ken-ichiro Shibata, Akihito Fujii, Shigeru Nakayama | 2010-06-22 |
| 7180178 | Semiconductor heat-dissipating substrate, and manufacturing method and package therefor | Kouichi Takashima, Shin-ichi Yamagata, Yugaku Abe | 2007-02-20 |
| 6979901 | Semiconductor heat-dissipating substrate, and manufacturing method and package therefor | Kouichi Takashima, Shin-ichi Yamagata, Yugaku Abe | 2005-12-27 |
| 6783867 | Member for semiconductor device using an aluminum nitride substrate material, and method of manufacturing the same | Kazutaka Sasaki, Hirohiko Nakata, Mitsunori Kobayashi | 2004-08-31 |
| 5998043 | Member for semiconductor device using an aluminum nitride substrate material, and method of manufacturing the same | Kazutaka Sasaki, Hirohiko Nakata, Mitsunori Kobayashi | 1999-12-07 |
| 5529852 | Aluminum nitride sintered body having a metallized coating layer on its surface | Hitoyuki Sakanoue | 1996-06-25 |
| 5292552 | Method for forming metallized layer on an aluminum nitride sintered body | Akira Yamakawa | 1994-03-08 |
| 5190601 | Surface structure of ceramics substrate and method of manufacturing the same | Akira Yamakawa | 1993-03-02 |
| 5134461 | Ceramics substrate with an improved surface structure for electronic components | Akira Yamakawa | 1992-07-28 |
| 5085923 | Heat-conductive aluminum nitride sintered body and method of manufacturing the same | Akira Yamakawa, Masaya Miyake, Hitoyuki Sakanoue, Hisao Takeuchi, Koichi Sogabe | 1992-02-04 |
| 5034357 | Heat-conductive aluminum nitride sintered body and method of manufacturing the same | Akira Yamakawa, Masaya Miyake, Hitoyuki Sakanoue, Hisao Takeuchi, Koichi Sogabe | 1991-07-23 |
| 5010388 | Connection structure between components for semiconductor apparatus | Hitoyuki Sakanoue, Hisao Takeuchi, Masaya Miyake, Akira Yamakawa, Yasuhisa Yushio +1 more | 1991-04-23 |
| 4965659 | Member for a semiconductor structure | Hitoyuki Sakanoue, Masaya Miyake, Akira Yamakawa | 1990-10-23 |
| 4886709 | Member for semiconductor apparatus | Hitoyuki Sakanoue, Hisao Takeuchi, Masaya Miyake, Akira Yamakawa, Yasuhisa Yushio | 1989-12-12 |