Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5529852 | Aluminum nitride sintered body having a metallized coating layer on its surface | Akira Sasame | 1996-06-25 |
| 5293509 | Sintered body of aluminum nitride | Akira Yamakawa, Masaya Miyake, Koichi Sogabe | 1994-03-08 |
| 5264388 | Sintered body of aluminum nitride | Akira Yamakawa, Masaya Miyake, Koichi Sogabe | 1993-11-23 |
| 5219803 | Sintered body of aluminum nitride | Akira Yamakawa, Masaya Miyake, Koichi Sogabe | 1993-06-15 |
| 5085923 | Heat-conductive aluminum nitride sintered body and method of manufacturing the same | Akira Yamakawa, Masaya Miyake, Hisao Takeuchi, Koichi Sogabe, Akira Sasame | 1992-02-04 |
| 5036026 | Sintered body of aluminum nitride and method for producing the same | Akira Yamakawa, Hisao Takeuchi | 1991-07-30 |
| 5034357 | Heat-conductive aluminum nitride sintered body and method of manufacturing the same | Akira Yamakawa, Masaya Miyake, Hisao Takeuchi, Koichi Sogabe, Akira Sasame | 1991-07-23 |
| 5010388 | Connection structure between components for semiconductor apparatus | Akira Sasame, Hisao Takeuchi, Masaya Miyake, Akira Yamakawa, Yasuhisa Yushio +1 more | 1991-04-23 |
| 4965659 | Member for a semiconductor structure | Akira Sasame, Masaya Miyake, Akira Yamakawa | 1990-10-23 |
| 4886709 | Member for semiconductor apparatus | Akira Sasame, Hisao Takeuchi, Masaya Miyake, Akira Yamakawa, Yasuhisa Yushio | 1989-12-12 |
| 4709844 | Pressure welding bonding apparatus | Yukio Sekiguchi, Hiroyasu Funakubo, Osamu Komura | 1987-12-01 |