Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7083759 | Method of producing a heat dissipation substrate of molybdenum powder impregnated with copper with rolling in primary and secondary directions | Norio Hirayama, Tadashi Arikawa, Yoshinari Amano, Hidetoshi Maesato, Hidefumi Hayashi +1 more | 2006-08-01 |
| 6926861 | Semiconductor package and method for producing heat-radiating substrate for it | Norio Hirayama, Akira Ichida, Yoshinari Amano, Kiyoshi Asai, Hidetoshi Maesato +2 more | 2005-08-09 |
| 6693353 | Semiconductor package and method for producing heat-radiating substrate for it | Norio Hirayama, Akira Ichida, Yoshinari Amano, Kiyoshi Asai, Hidetoshi Maesato +2 more | 2004-02-17 |
| 6595821 | Rotary anode for X-ray tube comprising an Mo-containing layer and a W-containing layer laminated to each other and method of producing the same | Masayuki Itoh, Koji Asahi, Yoshinari Amano, Tomohiro Takida | 2003-07-22 |
| 6475429 | Heat sink substrate consisting essentially of copper and molybdenum and method of manufacturing the same | Akira Ichida, Norio Hirayama, Kiyoshi Asai, Hidetoshi Maesato, Tadashi Arikawa | 2002-11-05 |
| 6271585 | Heat sink substrate consisting essentially of copper and molybdenum and method of manufacturing the same | Akira Ichida, Norio Hirayama, Kiyoshi Asai, Hidetoshi Maesato, Tadashi Arikawa | 2001-08-07 |
| 6233311 | Rotary anode for X-ray tube comprising an Mo-containing layer and a W-containing layer laminated to each other and method of producing the same | Masayuki Itoh, Koji Asahi, Yoshinari Amano, Tomohiro Takida | 2001-05-15 |
| 5481136 | Semiconductor element-mounting composite heat-sink base | Kenichiro Kohmoto | 1996-01-02 |
| 5451817 | Semiconductor-mounting heat-radiative substrates, a method of making and use thereof in semiconductor packages | Kenichiro Kohmoto | 1995-09-19 |
| 5448107 | Radiating fin having an improved life and thermal conductivity | Yugaku Abe | 1995-09-05 |
| 5305947 | Method for manufacturing semiconductor-mounting heat-radiative substrates and semiconductor package using the same | Kenichiro Kohmoto | 1994-04-26 |
| 5275782 | Housing for semiconductor device | Yugaku Abe, Tetsuya Hayoshi | 1994-01-04 |
| 5229549 | Ceramic circuit board and a method of manufacturing the ceramic circuit board | Akira Yamakawa, Nobuo Ogasa | 1993-07-20 |
| 5132779 | Housing for semiconductor device with occlusion gas removed | Yugaku Abe, Tetsuya Hayashi | 1992-07-21 |
| 4614638 | Process for producing sintered ferrous alloys | Nobuhito Kuroishi, Akio Hara | 1986-09-30 |
| 4457780 | Electric contact materials | Nobuhito Kuroishi, Yoshinari Amano, Akira Fukui | 1984-07-03 |