Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6926861 | Semiconductor package and method for producing heat-radiating substrate for it | Norio Hirayama, Mitsuo Osada, Yoshinari Amano, Kiyoshi Asai, Hidetoshi Maesato +2 more | 2005-08-09 |
| 6693353 | Semiconductor package and method for producing heat-radiating substrate for it | Norio Hirayama, Mitsuo Osada, Yoshinari Amano, Kiyoshi Asai, Hidetoshi Maesato +2 more | 2004-02-17 |
| 6610375 | Plasma facing components of nuclear fusion reactors employing tungsten materials | Masato Akiba, Kazuyuki Nakamura, Takehiko Hayashi | 2003-08-26 |
| 6518667 | Semiconductor package using micro balls and production method thereof | Hiroshi Yoshida, Masahiko Mizukami, Yoshihiko Doi | 2003-02-11 |
| 6475429 | Heat sink substrate consisting essentially of copper and molybdenum and method of manufacturing the same | Mitsuo Osada, Norio Hirayama, Kiyoshi Asai, Hidetoshi Maesato, Tadashi Arikawa | 2002-11-05 |
| 6271585 | Heat sink substrate consisting essentially of copper and molybdenum and method of manufacturing the same | Mitsuo Osada, Norio Hirayama, Kiyoshi Asai, Hidetoshi Maesato, Tadashi Arikawa | 2001-08-07 |
| 6261648 | Plasma facing components of nuclear fusion reactors employing tungsten materials | Masato Akiba, Kazuyuki Nakamura, Takehiko Hayashi | 2001-07-17 |
| 5493153 | Plastic-packaged semiconductor device having a heat sink matched with a plastic package | Tadashi Arikawa, Mitsuru Tsuchiya, Tadashi Igarashi | 1996-02-20 |