Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11380602 | Plating film and plated member | Kengo Goto, Akihisa Hosoe, Hiroya Sato, Masatoshi Nagashima, Shohei Murakami | 2022-07-05 |
| 10215512 | Heat spreader and method for manufacturing the same | Hiroaki Oki, Shouichi Inaba | 2019-02-26 |
| 7547412 | Composite material, method for producing same and member using same | Masayuki Itoh, Norio Hirayama, Yoshinari Amano, Nobuyuki Saitoh | 2009-06-16 |
| 7083759 | Method of producing a heat dissipation substrate of molybdenum powder impregnated with copper with rolling in primary and secondary directions | Mitsuo Osada, Norio Hirayama, Yoshinari Amano, Hidetoshi Maesato, Hidefumi Hayashi +1 more | 2006-08-01 |
| 6926861 | Semiconductor package and method for producing heat-radiating substrate for it | Norio Hirayama, Mitsuo Osada, Akira Ichida, Yoshinari Amano, Kiyoshi Asai +2 more | 2005-08-09 |
| 6693353 | Semiconductor package and method for producing heat-radiating substrate for it | Norio Hirayama, Mitsuo Osada, Akira Ichida, Yoshinari Amano, Kiyoshi Asai +2 more | 2004-02-17 |
| 6475429 | Heat sink substrate consisting essentially of copper and molybdenum and method of manufacturing the same | Mitsuo Osada, Akira Ichida, Norio Hirayama, Kiyoshi Asai, Hidetoshi Maesato | 2002-11-05 |
| 6271585 | Heat sink substrate consisting essentially of copper and molybdenum and method of manufacturing the same | Mitsuo Osada, Akira Ichida, Norio Hirayama, Kiyoshi Asai, Hidetoshi Maesato | 2001-08-07 |
| 5493153 | Plastic-packaged semiconductor device having a heat sink matched with a plastic package | Mitsuru Tsuchiya, Akira Ichida, Tadashi Igarashi | 1996-02-20 |