Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7547412 | Composite material, method for producing same and member using same | Masayuki Itoh, Tadashi Arikawa, Norio Hirayama, Nobuyuki Saitoh | 2009-06-16 |
| 7083759 | Method of producing a heat dissipation substrate of molybdenum powder impregnated with copper with rolling in primary and secondary directions | Mitsuo Osada, Norio Hirayama, Tadashi Arikawa, Hidetoshi Maesato, Hidefumi Hayashi +1 more | 2006-08-01 |
| 6926861 | Semiconductor package and method for producing heat-radiating substrate for it | Norio Hirayama, Mitsuo Osada, Akira Ichida, Kiyoshi Asai, Hidetoshi Maesato +2 more | 2005-08-09 |
| 6693353 | Semiconductor package and method for producing heat-radiating substrate for it | Norio Hirayama, Mitsuo Osada, Akira Ichida, Kiyoshi Asai, Hidetoshi Maesato +2 more | 2004-02-17 |
| 6595821 | Rotary anode for X-ray tube comprising an Mo-containing layer and a W-containing layer laminated to each other and method of producing the same | Masayuki Itoh, Koji Asahi, Mitsuo Osada, Tomohiro Takida | 2003-07-22 |
| 6233311 | Rotary anode for X-ray tube comprising an Mo-containing layer and a W-containing layer laminated to each other and method of producing the same | Masayuki Itoh, Koji Asahi, Mitsuo Osada, Tomohiro Takida | 2001-05-15 |
| 5708959 | Substrate for semiconductor apparatus | Mituo Osada, Nobuo Ogasa, Akira Ohtsuka | 1998-01-13 |
| 5563101 | Substrate for semiconductor apparatus | Mituo Osada, Nobuo Ogasa, Akira Ohtsuka | 1996-10-08 |
| 5525428 | Substrate for semiconductor apparatus | Mituo Osada, Nobuo Ogasa, Akira Ohtsuka | 1996-06-11 |
| 5409864 | Substrate for semiconductor apparatus | Mituo Osada, Nobuo Ogasa, Akira Ohtsuka | 1995-04-25 |
| 5342573 | Method of producing a tungsten heavy alloy product | Masahiro Omati, Junzo Matsumura | 1994-08-30 |
| 5099310 | Substrate for semiconductor apparatus | Mituo Osada, Nobuo Ogasa, Akira Ohtusuka | 1992-03-24 |
| 5086333 | Substrate for semiconductor apparatus having a composite material | Mituo Osada, Nobuo Ogasa, Akira Ohtsuka | 1992-02-04 |
| 4457780 | Electric contact materials | Mitsuo Osada, Nobuhito Kuroishi, Akira Fukui | 1984-07-03 |